This study aims at appraising the capability of tannic powders of African locust been pod husks (Parkia Biglobosa) and of the India tamarind (Pithecellobium dulce) peel to bind Africa antiaris sawdust particles in order to manufacture environmental panels without formaldehyde emission. In the process, the granulometry has been studied. Thus, four granular groups (g) are obtained: 1.6 < g ≤ 5; 0.8 < g ≤ 1.6; g ≤ 0.8; and the raw sawdust (non-sieved). The panels produced from the different powders have been characterized. The mechanical characteristics (MOE: modulus of elasticity and MOR: modulus of rupture) determined by the bending tests are found to respect the threshold specified by the ANSI A208.1 (Medium density fiberboard, National Particleboard Association, Gaithersburg, 2009) standard. The thermal conductivity values of the panels allow concluding that the manufactured panels are conventional insulators according to the French standards RT 2012. The analyses have shown that the panels are of Mean Density in conformity with ANSI A208.1 (Medium density fiberboard, National Particleboard Association, Gaithersburg, 2009) standard.
L’objectif de ce travail est de tester une nouvelle generation de liants entrant dans la fabrication des panneaux de particules sans generer des problemes lies a l’environnement et a la sante environnementale. Pour cela, des tests d’elaboration des panneaux de kenaf (hibiscus cannabinus l.) sont effectues en utilisant la colle d’os en perles a des temperatures et taux de liants variables. Le procede d’elaboration ainsi defini et applique a la temperature optimale de 140°C est mieux indique pour l’elaboration des panneaux de kenaf. En effet, a cette temperature, les valeurs des caracteristiquesmecaniques, module d’elasticite (MOE) et module de rupture (MOR) obtenues sur les panneaux realises, sont conformes a la norme ANSI A 208 1 1999montrant ainsi que la colle d’os en perles est bien indiquee pour l’elaboration des panneaux de kenaf. Mots cles : panneaux de particules, colle d’os en perles, Module d’elasticite, Module de Rupture. ABSTRACT The objective of this work is to experiment a new generation of bindersfor the manufacture of particle boards without causing any worldwide environment and specifically environmental health problems. For this, testsfor elaboration of the kenaf panels (Hibiscus cannabinus L.) are made using the beads bone glue at variable values of temperature and binder rate. The defined process, applied at optimal temperature of 140 °C, is best suited for production of kenaf panels. In fact, at this temperature, the obtained values for kenaf panels mechanical characteristics, asmodulus of elasticity and modulus of rupture, are conform with thosefrom ANSI A 208 1 1999 standard showing that the beadsbone glue is well indicated for elaboration of kenaf panels Keywords : Particle board, beads bone glue, modulus of elasticity, modulus of breaking.
This work developed a new organic composite as a building and furniture material for developing countries by recycling carpentry wastes of sawdust of the Iroko (M-excelesa) with the African locust bean pod (Parkia-biglobosa). A wide range of panels was manufactured by blending Iroko sawdust with the naturally found organic African locust bean. The mechanical and thermal properties of these panels were investigated using standard testing methods. Consequently, the results are presented in terms of thermal conductivity along with its mechanical properties. The submersion tests allowed determining the swelling and water absorption. This work showed that organic tannic powders could replace conventional toxic binders in particleboards.
The present study aims at valorizing two residues types of the foodless vegetable biomass which are abundant and very pollutant in Burkina Faso. To do it, first we try to identify the optimal values of chipboard elaboration parameters with kenaf and cotton stems by using a natural binder (the bone glue). Next we proceed to the elaboration of two panels types with optimized elaboration parameters. Besides we determine mechanical and thermal characteristics of elaborated panels with a view of an indoor thermal insulation application. Also it becomes necessary for us to determine by experimenting the thermal conductivity, Young's modulus, Coulomb's modulus, and the water inflation rate, taking into account some elaboration parameters on one hand and the correlation between mechanical and thermal properties on the other hand. Finally, the obtained results are compared with the panels properties values required by ANSI A 208.1-1999 standard.
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