The corrosion resistance of anodic oxide film sealed with alumina sol can improved. Cu2+ was put into the alumina sol so that antibacterial property was endowed to the sealed film. Composition, morphology and corrosion resistance of sealed film doped with Cu2+ were studied by DSC, EIS and SEM etc. The film sealed by doping Cu2+ in sol has less and narrower crack on the surface than the one without Cu2+. The gel without Cu2+ has more chemical reaction and phase transition than that with Cu2+ in the heating process observing from the DSC curve, which results in more cracks on the surface of sealed films without Cu2+. Sol doped with Cu2+ can enhance corrosion resistance inferred from the polarization curve, in a way. The films sealed by sol with Cu2+ have a good antibacterial on Staphylococcus aureus. The antibacterial rate is more than 99%. The results show sol doped Cu2+ not only improve corrosion resistance but also have antibacterial property.
The amorphous nano-sized silicon nitride powders were sintered by liquid phase sintering method. Si3N4-Si2N2O composites were in-situ fabricated. The Si2N2O phase was generated by an in-situ reaction 2Si3N4(s)+1.5O2(g)=3Si2N2O(s)+N2(g). The content of Si2N2O phase up to 60% was obtained at a sintering temperature of 1650°C and reduced when the sintering temperature increased or decreased, which indicates that the reaction is reversible. The mass loss, relative density and average grain size increase with increasing of sintering temperature. The average grain size is less than 500nm when the sintering temperature is below 1700°C. During the sintering procedure, there is a complex crystallization and phase transition: amorphous Si3N4 → equiaxial α-Si3N4→ equiaxial β-Si3N4 → rod-likeSi2N2O → needle-like β-Si3N4. Small round-shaped β-Si3N4 particles are entrapped in the Si2N2O grains and a high density of staking faults are situated in the middle of Si2N2O grains at a sintering temperature of 1650°C.