Hui Huang

Huaqiao University

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Xi Peng Xu

Second Military Medical University

Xipeng Xu

Huaqiao University

Xinjiang Liao

Huaqiao University

Changcai Cui

China Jiliang University

Guoqin Huang

Gaozhou People's Hospital

Dekui Mu

Huaqiao University

Han Huang

First Affiliated Hospital of Wenzhou Medical University

Zhiteng Xu

Huaqiao University

Yueqin Wu

University of Queensland

Zhiyuan Lai

Huaqiao University

Cooperative Institutions

Huaqiao University

102

Chinese Academy of Sciences

University of Chinese Academy of Sciences

Central South University

Harbin Institute of Technology

South China University of Technology

University of Queensland

Jimei University

Beijing Institute of Technology

Huazhong University of Science and Technology

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Fabrication and Application of Grinding Wheels with Soft and Hard Composite Structures for Silicon Carbide Substrate Precision Processing

Materials (2024)

Qiufa Luo Jieming Chen Jing Lu Congming Ke Guangqiu Hu

In silicon carbide processing, the surface and subsurface damage caused by fixed abrasive grinding significantly affects the allowance of the next polishing process. A novel grinding wheel with a soft and hard composite structure was fabricated for the ultra-precision processing of SiC substrates, and the grinding performance of the grinding wheel was assessed in this study. Different types of gels, heating temperatures, and composition ratios were used to fabricate the grinding wheel. The grinding performance of the grinding wheel was investigated based on the surface integrity and subsurface damage of SiC substrates. The results showed that the grinding wheel with a soft and hard composite structure was successfully fabricated using freeze-dried gel with a heating temperature of 110 °C, and the component ratio of resin to gel was 4:6. A smooth SiC substrate surface with almost no cracks was obtained after processing with the grinding wheel. The abrasive exposure height was controlled by manipulating the type and ratio of the gel. Furthermore, the cutting depth in nanoscale could be achieved by controlling the abrasive exposure height. Therefore, the fabrication and application of the grinding wheels with soft and hard composite structures is important for the ultra-precision processing of large-size SiC substrates.

Surface Integrity

10.3390/ma17092079

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Citations (2)

Paper-Based Colorimetric Sensor Array Integrated with Smartphone App for the Identification of Tea Polyphenol and Longjing Tea

Xiaoyu Yang Jie Li Zhichun Bi Le Wang Yongxin Li

Identification

10.2139/ssrn.5096871

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Citations (0)

Experimental study on the formation mechanism of saw marks in wire sawing

International Journal of Mechanical Sciences (2023)

Zhiyuan Lai Xinjiang Liao Hao Yang Zhongwei Hu Hui Huang

Flatness (cosmology)

Reciprocating motion

Circular saw

10.1016/j.ijmecsci.2023.108894

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Citations (8)

Wear of a brazed diamond grinding wheel with diamonds precovered by brazing alloy

International Journal of Abrasive Technology (2010)

Guoqin Huang Hui Huang Xipeng Xu

The wear of a brazed diamond wheel with diamond grits precovered by brazing alloy was investigated in comparison with a traditional brazed wheel whose grits were without coverings. The two wheels were brazed in vacuum. The wear of the two wheels was tested through grinding of granite, during which grinding forces were measured and the wear states of diamond grits were observed. It is shown that the brazed diamonds precovered with brazing alloy exhibited stronger self-sharpening ability and rupture resistance. Subsequently, the wheel with precovered diamonds performed lower grinding force and better wear performance.

Brazing

Diamond grinding

10.1504/ijat.2010.032464

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Citations (7)

Simulation and Experimental Research on the Slicing Temperature of the Sapphire with Diamond Wire

International Journal of Computational Methods (2018)

Xuerun Huang Hui Huang Hua Guo

Temperature has an important influence on the sapphire wafer quality sliced using fixed abrasive diamond wire saw. In this paper, temperature field distribution on the wafer outer surface during the slicing of sapphire ingot was computationally and experimentally studied by taking the effect of coolant into account. The simulation temperature field distribution without coolant is in good agreement with the experimental result, and the cutting depth increases, the maximum temperature located at the middle of slicing zone. Coolant had a significant influence on the wafer temperature field distribution and the movement of slicing wire in a narrow kerf affected the coolant supply, which caused a deviation in the temperature distribution obtained by numerical simulation result and experimental measurement.

Ingot

10.1142/s021987621843003x

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Citations (11)

Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures

International Journal of Refractory Metals and Hard Materials (2017)

Xinjiang Liao Dekui Mu Jianxin Wang Guoqin Huang Hui Huang

Brazing

10.1016/j.ijrmhm.2017.04.005

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Citations (20)

Characterisation of diamond abrasive grains of grinding tools using industrial X-ray computed tomography

The International Journal of Advanced Manufacturing Technology (2020)

Luca Pagani Qunfen Qi Jing Lu Hui Huang Guoqin Huang

Abstract In this paper, a characterisation of diamond abrasive grains of grinding tools using industrial X-ray computed tomography (XCT) is carried out. One of the most challenge tasks in the characterisation is extracting the diamond abrasive grains from the XCT volume data. Methods that are able to extract the grains are then developed and introduced in this paper. The first step is to create a triangular mesh surface from the reconstructed volume file using a gradient anisotropic diffusion filter. The second step is to convert the measured greyscale volume into a signed distance field using a global threshold value and then a localised method for grain segmentation. To validate the proposed method, three different types of grinding tool specimens are measured and analysed. Each abrasive grain is segmented and the distributions of grains (with both random and designed patterns) are then calculated, plotted and analysed. The quantitative analysis clearly shows the deviations between the measured distribution and the designed pattern of the grinding tool, which indicates that the proposed method can provide an accurate and comprehensive characterisation of the grinding tools.

Diamond grinding

10.1007/s00170-020-06238-1

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Citations (2)

Deformation and removal mechanism of single crystal gallium nitride in nanoscratching

Ceramics International (2022)

Shuiping Tan Yunpeng Wang Hui Huang Yueqin Wu Han Huang

Abrasive machining

Deformation mechanism

10.1016/j.ceramint.2022.05.033

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Citations (21)

Development of Abrasive Tools: State-of-the-art and Prospectives

Journal of Mechanical Engineering (2022)

XU Xi-peng Hui Huang Zhongwei Hu Changcai Cui Xinjiang Liao

摘要: 磨粒加工技术的快速发展带动了磨粒工具技术的不断进步。发展高性能的磨粒工具对提高生产效率、提升加工精度有着重要的意义。从加工中磨粒工具的失效形式入手,分析了不同加工目标下磨粒与工件材料加工界面之间的力作用、温度作用、化学作用对磨粒工具失效的影响机制;概述了基于界面作用机理调控的磨粒工具设计及制造技术;归纳了现有磨粒工具的表面状态测量与评价技术;总结了磨粒工具使用过程中的界面作用调控技术;结合智能磨粒加工技术的发展对磨粒工具的未来趋势提出了展望。

10.3901/jme.2022.15.002

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Citations (1)

Study on seismic performance of BFRP geogrid reinforced Tibetan rubble wall

AIP conference proceedings (2018)

Yang Dan Bin Jia Hui Huang Chuangli Deng

For the study of BFRP geogrid influence on Tibetan rubble wall seismic performance, in this paper, on the premise of not change the way of traditional masonry, laying and not join geogrid respectively on the the rubble wall, and carries on the cyclic loading experiment on them. The damage characteristics, crack width and seismic performance of the rubble walls with BFRP geogrid are studied. The experimental results show that the deformation of the rubble wall is mainly the shear deformation under the action of horizontal force, and the bearing capacity and energy dissipation capacity of the wall can be improved significantly after joining the geogrid.

Geogrid

Rubble

10.1063/1.5029728

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Citations (0)