F. Pérez‐Willard

Carl Zeiss (Germany)

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Dagmar Gerthsen

Karlsruhe Institute of Technology

Martin Wegener

Karlsruhe Institute of Technology

C. Sürgers

Karlsruhe Institute of Technology

Tobias Volkenandt

Carl Zeiss (Germany)

H. v. Löhneysen

Karlsruhe Institute of Technology

M. Deubel

Karlsruhe Institute of Technology

Georg von Freymann

Fraunhofer Institute for Industrial Mathematics

Nicolas Tétreault

École Polytechnique Fédérale de Lausanne

M. Hetterich

Karlsruhe Institute of Technology

H. Kalt

Karlsruhe Institute of Technology

Cooperative Institutions

Karlsruhe Institute of Technology

Carl Zeiss (Germany)

Karlsruhe University of Education

Carl Zeiss (United States)

University of Konstanz

Center for NanoScience

Applied Photonics (United Kingdom)

University of East Anglia

University of Stuttgart

Centre National de la Recherche Scientifique

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Argon broad ion beam tomography in a cryogenic scanning electron microscope: a novel tool for the investigation of representative microstructures in sedimentary rocks containing pore fluid

Journal of Microscopy (2013)

Guillaume Desbois János L. Urai F. Pérez‐Willard Zsolt Radí S. OFFERN

Summary The contribution describes the implementation of a broad ion beam (BIB) polisher into a scanning electron microscope (SEM) functioning at cryogenic temperature (cryo). The whole system (BIB‐cryo‐SEM) provides a first generation of a novel multibeam electron microscope that combines broad ion beam with cryogenic facilities in a conventional SEM to produce large, high‐quality cross‐sections (up to 2 mm 2 ) at cryogenic temperature to be imaged at the state‐of‐the‐art SEM resolution. Cryogenic method allows detecting fluids in their natural environment and preserves samples against desiccation and dehydration, which may damage natural microstructures. The investigation of microstructures in the third dimension is enabled by serial cross‐sectioning, providing broad ion beam tomography with slices down to 350 nm thick. The functionalities of the BIB‐cryo‐SEM are demonstrated by the investigation of rock salts (synthetic coarse‐grained sodium chloride synthesized from halite‐brine mush cold pressed at 150 MPa and 4.5 GPa, and natural rock salt mylonite from a salt glacier at Qom Kuh, central Iran). In addition, results from BIB‐cryo‐SEM on a gas shale and Boom Clay are also presented to show that the instrument is suitable for a large range of sedimentary rocks. For the first time, pore and grain fabrics of preserved host and reservoir rocks can be investigated at nm‐scale range over a representative elementary area. In comparison with the complementary and overlapping performances of the BIB‐SEM method with focused ion beam‐SEM and X‐ray tomography methods, the BIB cross‐sectioning enables detailed insights about morphologies of pores at greater resolution than X‐ray tomography and allows the production of large representative surfaces suitable for FIB‐SEM investigations of a specific representative site within the BIB cross‐section.

Sublimation

Halite

10.1111/jmi.12011

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Citations (72)

Three-Dimensional Silicon Photonic Crystals from Polymer Templates: Single versus Double Inversion

Photonic Metamaterials: From Random to Periodic (2006)

M. Hermatschweiler M. Deubel Martin Wegener F. Pérez‐Willard Nicolas Tétreault

We present recent progress in converting polymer templates into three-dimensional silicon photonic crystals by using double (single) inversion. This has led to woodpiles (inverse woodpiles) with improved structural and optical quality.

Template

10.1364/meta.2006.mc3

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Fully UHV compatible fabrication of submicrometer-spaced electrical contacts

Review of Scientific Instruments (2006)

R. Hoffmann Claus Gärtner F. Pérez‐Willard Martin Sauter C. Sürgers

Electrical contacts

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Use of 3D metrology for process control

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (2009)

Bart Rijpers Jo Finders Hidekazu Suzuki Toshiaki Fujii Yuichiro Yamazaki

As device structures continue to shrink and new materials are introduced, Three Dimensional (3D) Metrology becomes more important. The creation of 3D Metrology data is defined as the generation of statistically relevant 3D information used in R&D and/or semiconductor manufacturing. Parameters of interest are: profile shape, side wall angle, material properties, height of the structure, as well as the variation within a die, on the wafer, between wafers. In this paper we will show how this information is used to calibrate process control systems in a semiconductor fab. Also, results will be shown on how this information may be used to compare different types of Metrology equipment e.g. CD-SEM and optical CD metrology techniques like scatterometry. Certain applications, such as the generation of profile information for 55 nm dense contact holes in photoresist, require new technology to minimize damage to the soft photoresist. A new technique called in-situ broadband argon cleaning will be presented. Finally, the application of the argon column for protective coating deposition of sub-45 nm photoresist lines will be discussed.

Photoresist

Semiconductor device fabrication

10.1117/12.816370

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Citations (3)

Fully ultrahigh-vacuum-compatible fabrication of submicrometer-spaced electrical contacts

Review of Scientific Instruments (2006)

Claus Gärtner Randy Hoffman F. Pérez‐Willard Martin Sauter C. Sürgers

We present an approach by which submicrometer-spaced electrical contacts can be fabricated on virtually any surface under ultrahigh-vacuum conditions. The metallic contacts are formed by subsequent deposition through a macroscopic mask and a nanostructured stencil mask. The stencil mask with a high aspect ratio was obtained by nanopatterning of suspended low-stress Si3+xN4−x membranes with a focused ion-beam system. The fabricated contacts can be electrically connected in situ by simply exchanging the mask carrier by a second, spring-loaded, carrier.

Stencil

Electrical contacts

Vacuum deposition

Deposition

10.1063/1.2163973

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Citations (6)

Towards Automatic Lamella Thinning Using Live Thickness Measurements and Smart End-Point Detection

Microscopy and Microanalysis (2017)

Tobias Volkenandt F. Pérez‐Willard Michael Rauscher Pascal Anger

Thinning

Lamella (surface anatomy)

Middle lamella

Multi point

10.1017/s1431927617002203

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Citations (3)

Nanostructuring the graphite basal plane by focused ion beam patterning and oxygen etching

Nanotechnology (2006)

Artur Böttcher Moritz Heil Ninette Stürzl Stefan S. Jester Sharali Malik

Ga+ focused ion beam (FIB) patterning was used to structure highly oriented pyrolytic graphite surfaces with square, periodic arrays of amorphous carbon defects (mesh sizes: 300 nm–2 µm). Controlled oxygen etching of these arrays leads to matrices of uniform, orientationally aligned, nm-sized, hexagonal holes. The properties of the resulting hole assembly (hole depths and lateral hole dimensions) have been investigated by means of atomic force microscopy, scanning electron microscopy and FIB sectioning. The hole dimensions and uniformity both depend on the FIB parameters and etching conditions. Etching temperatures from 500 to 700 °C were applied. Initial etch rates of up to 106 C s−1 per individual hole were observed when using oxygen pressures of 200 mbar. For an etch temperature of 590 °C the rate of etching of individual holes was found to depend measurably on the inter-hole separation. This confirms that the associated reaction kinetics is mediated by the finite diffusion length of reactive oxygen species along the graphite basal plane. Prolonged etching results in hole–hole contact and generation of mesa arrays of controllable size and shape.

Pyrolytic carbon

10.1088/0957-4484/17/23/029

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Citations (22)

Coupled micro-cavities based on GaAs pillars

Verhandlungen der Deutschen Physikalischen Gesellschaft (2007)

Markus Karl W. Löffler Shike Li T. Passow H. Kalt

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Single and coupled photonic cavities - AlAs/GaAs DBR pillars and GaAs pyramids

AIP conference proceedings (2007)