In this paper we present mechanics and materials aspects of elastomeric stamps that have angled features of relief on their surfaces, designed to enable control of adhesion strength by peeling direction, in a way that can be exploited in schemes for deterministic assembly by transfer printing. Detailed mechanics models capture the essential physics of interface adhesion in this system. Experiments with cylindrical stamps that have this design demonstrate their potential for use in a continuous, roller mode of operation.
Direct writing of color patterns is investigated in (AgI)x(AgPO3)1−x ionically conductive glasses through the use of an electron beam. A range of glasses from x = 0–0.5 are explored to represent varying levels of ionic conductivity and the gamut of colors possible depending on substrate composition. For AgIAgPO3, writing capabilities are found to include a linear, tunable optical density of patterns in transmission, as well as diffraction limited color resolution in reflection. Writing at multiple currents, beam energies, and raster techniques are performed to explore the sensitivity to variations of process parameters. With advanced multiple beam voltage patterning techniques, the authors demonstrate the capability to both generate new colors as well as erase patterns previously created with this process.
This paper presents the design, kinematics, fabrication and characterization of a monolithic micro positioning two degree-of-freedom translational (XY) stage. The design of the proposed MEMS (micro-electro-mechanical system) stage is based on a parallel kinematics mechanism (PKM). The stage is fabricated on a silicon-on-insulator (SOI) substrate. The PKM design decouples the motion in the XY directions. The design restricts rotations in the XY plane while allowing for an increased motion range and produces linear kinematics in the operating region (or workspace) of the stage. The truss-like structure of the PKM also results in increased stiffness by reducing the mass of the stage. The stage is fabricated on a silicon-on-insulator (SOI) wafer using surface micromachining and a deep reactive ion etching (DRIE) process. Two sets of electrostatic linear comb drives are used to actuate the stage mechanism in the X and Y directions. The fabricated stage provides a motion range of more than 15 µm in each direction at a driving voltage of 45 V. The resonant frequency of the stage under ambient conditions is 960 Hz. A high Q factor (∼100) is achieved from this parallel kinematics mechanism design.
An entry from the Cambridge Structural Database, the world’s repository for small molecule crystal structures. The entry contains experimental data from a crystal diffraction study. The deposited dataset for this entry is freely available from the CCDC and typically includes 3D coordinates, cell parameters, space group, experimental conditions and quality measures.
We report a top-down fabrication method that involves the combination of superionic-solid-state-stamping (S4) patterning with metal-assisted-chemical-etching (MacEtch), to produce silicon nanowire arrays with defined geometry and optical properties in a manufacturable fashion.
Abstract Factory technologies have evolved to incorporate a great deal of manufacturing flexibility. Programmable automation in the form of CNC and PLCs along with hardware innovations (quick-change tooling, for example) and various operator assist technologies enable a high level of shop-floor flexibility. Possibly, the most inflexible part of a factory is the manufacturing information system. Customized for manufacturers by system integrators, these systems are often large monolithic systems assembled around an ERP/MRP framework or a precariously integrated set of decision-support software tools with a patchwork of communications enabling information flow between them. On the other hand, cloud-based information service platforms such as those encountered in social networks and service brokers have seen rapid and multiple cycles of evolution resulting in a meteoric rise in their ability to handle increasingly large data scales and rates, while still maintaining their elasticity and flexibility. This rapid evolution of cloud-based information services has ignited a new era in the manufacturing industry as evidenced by emerging manufacturing cyberphysical system technologies such as the Industrial Internet of Things (IIoT), and Cloud Manufacturing (CM). These technologies are part of the broader context of what is thought to be the unfolding fourth industrial revolution (Industry 4.0 or Digital Manufacturing). This revolution places at its core, connectivity, information, and machine-based intelligence to create a new paradigm for manufacturing that is highly flexible, scalable, responsive, and intelligent. This paper describes how we leveraged the newest advances in CPS, IIoT, CM, and distributed systems to create a flexible manufacturing information system infrastructure that separates information collection and distribution for decision-making functions. The first part of the paper introduces the architecture for a novel full-stack manufacturing infrastructure that is envisioned to facilitate and track the interaction between a manufacturing job, physical resources, and the software services (or apps) around them. We call this platform the Operating System for Cyber-physical Manufacturing (OSCM). In the second part of the paper, we introduce an event-based architecture for OSCM so that resource or transaction related events/data can be flexibly distributed to different decision-making/manufacturing software tools through an event/message exchange/bus. Further, such an architecture allows modularization and incremental development of different manufacturing software tools and services as new needs are identified.
