Chia-Ken Leong

Advanced Micro Devices (Canada)

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D.D.L. Chung

University at Buffalo, State University of New York

Yasuhiro Aoyagi

University at Buffalo, State University of New York

J.M. Chin

Advanced Micro Devices (Canada)

K.N. Seetharamu

PES University

Timothy A. Howe

University at Buffalo, State University of New York

Gotthard Jungnickel

GlobalFoundries (United States)

M. C. Ong

Advanced Micro Devices (Canada)

Parisa Pour Shahid Saeed Abadi

Michigan Technological University

Z. Syahirah

Nanyang Technological University

Frank Kuechenmeister

GlobalFoundries (Germany)

Cooperative Institutions

University at Buffalo, State University of New York

Advanced Micro Devices (Canada)

Universiti Sains Malaysia

GlobalFoundries (United States)

Massachusetts Institute of Technology

Brigham and Women's Hospital

Nanyang Technological University

GlobalFoundries (Germany)

Advanced Micro Devices (United States)

Purdue Pharma (Canada)

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Carbon black pastes as coatings for improving thermal gap-filling materials

Carbon (2005)

Chia-Ken Leong Yasuhiro Aoyagi D.D.L. Chung

Brass

Carbon fibers

Thermal grease

10.1016/j.carbon.2005.09.002

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Citations (72)

Factors That Govern the Performance of Thermal Interface Materials

Journal of Electronic Materials (2008)

Parisa Pour Shahid Saeed Abadi Chia-Ken Leong D.D.L. Chung

Thermal grease

10.1007/s11664-008-0563-8

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Citations (27)

Carbon-black thixotropic thermal pastes for improving thermal contacts

Journal of Electronic Materials (2005)

Chia-Ken Leong Yasuhiro Aoyagi D.D.L. Chung

Thixotropy

10.1007/s11664-005-0259-2

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Citations (30)

Improving the electrical and mechanical behavior of electrically conductive paint by partial replacement of silver by carbon black

Journal of Electronic Materials (2006)

Chia-Ken Leong D.D.L. Chung

Filler (materials)

Volume fraction

Carbon fibers

10.1007/s11664-006-0193-y

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Citations (30)

Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages

G.A. Quadir Chia-Ken Leong Gautham Krishnan K.N. Seetharamu

In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure flows through the tubes of the heat exchanger. The vapour is then cooled by ambient air in free or forced convection environments. The finite element method is used in the analysis. The dielectric fluid used is FC-72. The effects of parameters like the tube length, ambient temperature, mass flow rate of the dielectric fluid, etc., on the performance of the heat exchanger have been studied. The results are also presented in the form of /spl epsiv/-NTU (heat transfer effectiveness-number of transfer units) curves. The proposed method may be used to check the adequacy of the number of tubes provided in the existing wire-on-tube heat exchangers for complete vapour condensation when the operating conditions are different from the design conditions.

Condenser (optics)

Enclosure

Immersion

10.1109/eptc.2000.906414

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Citations (0)

Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance

Carbon (2003)

Chia-Ken Leong D.D.L. Chung

Thermal grease

Thermal Stability

10.1016/s0008-6223(03)00247-1