Kazuhiko Sugiura

University of Occupational and Environmental Health Japan

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Research Field

Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion

Journal of Materials Science (2019)

Tomohito Iwashige Takeshi Endo Kazuhiko Sugiura Kazuhiro Tsuruta Yuichi Sakuma

10.1007/s10853-019-04028-z

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Citations (3)

Real-time monitoring and diagnosis of die attach structure deterioration by using acoustic emission method

2022 International Conference on Electronics Packaging (ICEP) (2022)

Zheng Zhang Aiji Suetake Chuantong Chen Osamu Katayama Hiroshi Ishino

In this work, we assembled thermal cycling equipment by a halogen lamp heater and applied the acoustic emission (AE) technique to real-time monitor and diagnose the health state of die attach structures used in power electronics. The assembled equipment is able to execute a cycling environment with a temperature variation from room temperature to 165 °C. Meanwhile, AE monitoring can be applied at the same time to real-time diagnose the health condition of a die attach structure. A soldered die attach structure was tested by 10000 cycles on this platform. AE signals were acquired during the cycling test, which originated from solder layer cracks that were confirmed by scanning acoustic tomography observations. This platform shows a superior specialty in detecting cracking of solder layer due to the high sensitivity of AE monitoring. Meanwhile, the cumulative AE counts that indicate the degree of cracking can be an important indication for diagnosing the health condition of the die attach structure.

Temperature cycling

Acoustic Emission

10.23919/icep55381.2022.9795523

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Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density

Chuantong Chen Aya Iwaki Aiji Suetake Kazuhiko Sugiura Kiyoshi Kanie

Cu sinter joining technology have got a lot attention for next-generation wide band gap (WBG) power modules which will subject a high temperature above 250 °C and a high current density. In this study, bonding performances of Cu sinter joining on different metallization substrates were investigated at a low temperature low pressure in N2 atmosphere. Die shear strength and fracture behavior of the joint structure on bare Cu substrate and different metallized Cu substrates including Cu/Ni-P, Cu/Ni-P/Au, Cu/Ni-P/Co-W-P, Cu/Ni-P/Pd-P/Au were evaluated. The results show that Cu sinter joining on bare Cu substrate possessed the highest shear strength above 60 MPa, further better than that other Cu substrate with metallization layers. In addition, reliability evaluation of Cu die attached structure on bare Cu substrate and Ni-P metallized substrate during a power cycling in a high current density of 814.8 A/cm ² were also investigated. The results show almost not on-resistance change after 3000 cycles for the both cases.

Shear Strength

10.23919/ispsd50666.2021.9452283

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Citations (1)

CCDC 137441: Experimental Crystal Structure Determination

The Cambridge Structural Database (2001)

T. Akutagawa Tadashi Hasegawa T. Nakamura S. Takeda Tamotsu Inabe

An entry from the Cambridge Structural Database, the world’s repository for small molecule crystal structures. The entry contains experimental data from a crystal diffraction study. The deposited dataset for this entry is freely available from the CCDC and typically includes 3D coordinates, cell parameters, space group, experimental conditions and quality measures.

Crystal (programming language)

10.5517/cc4m0lb

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Citations (0)

CCDC 127642: Experimental Crystal Structure Determination

The Cambridge Structural Database (2001)

Durrell K. Rittenberg Kazuhiko Sugiura A.M. Arif Y. SAKATA C.D. Incarvito

Crystal (programming language)

10.5517/cc48thp

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Citations (0)

6-in-1 Silicon carbide power module for high performance of power electronics systems

Hiroshi Ishino Tomokazu Watanabe Kazuhiko Sugiura Kazuhiro Tsuruta

The excellent characteristics (low power loss, high speed/high temperature operation) of SiC semiconductors can contribute to realizing smaller power converter with a higher power output. Using our own packaging technology of double-sided cooling and SiC devices, we have developed the new, small 6-in-1 power module with high output power density. If the inductance of the main circuit is large, it will cause a large surge voltage when switched. Therefore, we have incorporated the optimum low inductance structure into this module, and have made it possible to drive the SiC device at high speed. Using this module, we have built a prototype of inverter unit with 75 kW output power, and have achieved an efficiency of 99% and a power density of 100 kW/L.

Power module

Power Electronics

Power density

Auxiliary power unit

High Voltage

10.1109/ispsd.2014.6856072

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Citations (42)

Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment

Journal of Alloys and Compounds (2015)

S.W. Park Shijo Nagao Yoshitaka Kato H. Ishino Kazuhiko Sugiura

Eutectic bonding

Shear Strength

Liquid phase

10.1016/j.jallcom.2015.02.223

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Citations (11)

Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure

IEEE Transactions on Components Packaging and Manufacturing Technology (2019)

Kazuhiko Sugiura Tomohito Iwashige Kazuhiro Tsuruta Chuantong Chen Shijo Nagao

Silicon carbide (SiC) power modules with Ag sinter-bonding die attach were designed on the basis of thermal stress analysis for reliable high-temperature operations. Both the finite-element analysis (FEA) simulations and preliminary experiments confirmed that inserting the direct-bonded-copper (DBC) substrates can effectively reduce the maximum thermal stress in the module. A prototype SiC power module using sintered Ag die attach with a DBC substrate was designed and fabricated. The modules exhibited excellent durability in power cycling between 65 °C and 250 °C up to 20 000 cycles. FEA calculations of cumulative thermal strain and stress distributions adequately predicted the initial cracking position in the specimens after prolonged power cycles, observed by scanning electron microscopy.

dBc

Temperature cycling

Stress relaxation

Power module

10.1109/tcpmt.2019.2901543

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Citations (53)

Sensitivity analysis on the fatigue factors for fatigue reliability evaluation

CRC Press eBooks (2024)

M.Z. Mili Kazuhiko Sugiura Yasuo Kitane Ryoichi Matsumoto

10.1201/9781003483755-26

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