The paper aims to study the influence of furized gypsum fly ash three constituent mixture subtle structure to performance by analyzing furized gypsum fly ash three constituent IR, SEM, X-ray phase and DTA. The results show that the reason why furized gypsum fly ash three constituent has the characteristics of high strength in the early stage and good endurance quality is that furized gypsum fly ash concrete has the double actived effect of alkali-activated and sulfate-activated. The development of sclerotium strength mainly relies on ettringite and hydrated calcium silicate gel. During the process of hydration, ettringite and CSH gel hydration increase continuously, hardened structure becomes dense and strength continues to increase.
The utilization of stay in place formwork in concrete structure has received considerable attention in recent years. It is comparatively low labor intensity, readily available and has a range of attractive properties and characteristics that makes it suitable for a variety of building and construction applications. The fabrication and seismic behavior was studied in this paper. The experiments have shown that sufficient data have been obtained to give confidence in the reinforcing mechanism of stay in place construction formwork, and future work need only be focused on formwork design and standardization.
Selenium (Se), one of the indispensable nutrients for both human health and animal growth, participates in various physiological functions, such as antioxidant and immune responses and metabolism. The role of dietary Se, in its organic and inorganic forms, has been well documented in domestic animals. Furthermore, many feeding strategies for different animals have been developed to increase the Se concentration in animal products to address Se deficiency and even as a potential nutritional strategy to treat free radical-associated diseases. Nevertheless, studies on investigating the optimum addition of Se in feed, the long-term consequences of Se usage in food for animal nutrition, the mechanism of metallic Se nanoparticle (SeNP) transformation in vivo, and the nutritional effects of SeNPs on feed workers and the environment are urgently needed. Starting from the absorption and metabolism mechanism of Se, this review discusses the antioxidant role of Se in detail. Based on this characteristic, we further investigated the application of Se in animal health and described some unresolved issues and unanswered questions warranting further investigation. This review is expected to provide a theoretical reference for improving the quality of food animal meat as well as for the development of Se-based biological nutrition enhancement technology.
In this paper, we have studied various properties of UMG silicon wafers by combining four-point probe, microwave photo-conductance decay (μ-PCD), Fourier transform infrared (FTIR) spectroscopy,Inductively coupled plasma-mass spectrometry (ICP-MS) and optical microscopy techniques. The results show that the resistivity and the minority-carrier lifetime of UMG silicon are lower than that of standard multicrystalline material, while the detrimental interstitial iron concentration is larger. The concentration of substitutional carbon, interstitial oxygen and dislocation density are close to that in the standard multi-crystalline silicon. Furthermore, a phosphorous gettering has been used to improve the quality of UMG samples. It is found that phosphorus gettering in UMG silicon can increase the minority carrier lifetime and reduce the interstitial iron concentration. But, the minority-carrier lifetime is still not as high as the conventional/standard silicon counterpart after gettering. These results will help us to better understand the properties of UMG silicon wafer.
Package on Package (PoP) is a widely used high density package solution for package stacking technology in various device applications. Normally, the top package will connect to the bottom package by solder ball with several hundred micrometer diameter. The I/O number will be limited due to the solder ball will collapse during the reflow. In this study, a copper pillar with diameter of 200μm and height of 150-180μm will be used to replace the solder ball. With the structure of copper pillar, only a very small volume of solder will be used for the joint to connect the top and bottom package. In this paper, the finite element Modeling (FEM) simulation will be used to calculate the temperature distribution in the new PoP package with copper pillar. Also, the Cu pillar/solder joint microstructure evolution will be studied in several reliability tests, including 500 cycles temperature cycling test (TCT) and high temperature storage test (HTST) at 150°C with 500h.
'/%3e%3cuse xlink:href='%23a' transform='rotate(23.036 .093 25.536)'/%3e%3cuse xlink:href='%23a' transform='rotate(45.87 1.273 16.18)'/%3e%3cuse xlink:href='%23a' transform='rotate(69.945 .996 12.078)'/%3e%3cuse xlink:href='%23a' transform='rotate(20.66 -19.689 31.932)'/%3e%3c/svg%3e)
