J. Derksen

Siemens (China)

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S. Han

National University of Singapore

Jung‐Hoon Chun

Sungkyunkwan University

Sang‐Jun Han

Seoul National University

Jung-Hoon Chun

Massachusetts Institute of Technology

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Massachusetts Institute of Technology

SK Group (South Korea)

National University of Singapore

Korea Institute of Finance

Sungkyunkwan University

Solid (South Korea)

Dongguk University

Agency for Defense Development

Novartis-MIT Center for Continuous Manufacturing

Nanyang Technological University

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Extrusion-spin coating: an efficient photoresist coating process for wafers

J. Derksen Sang‐Jun Han Jung-Hoon Chun

Coating photoresist onto semiconductor wafers is a critical step in the microlithography process. As the critical dimension of semiconductor devices becomes smaller, the process of coating wafers with photoresist must improve as well; the coating must be thinner, more uniform, and have fewer defects to yield satisfactory results. Spin coating is the typical method used to apply a thin coat of photoresist to semiconductor wafers. Although spin coating has basically met the coating uniformity, thickness, cycle time, and defect level requirements of the current industry standard, it has done so at the cost of wasting most of the photoresist applied to the wafers. Extrusion-spin coating, a newly developed coating method, has the potential to reduce the amount of photoresist used in the process while maintaining the other desirable attributes of spin coating. Our experimental results indicate that by using the extrusion-spin coating method, the coating efficiency can be improved to over 33% or better as compared to the efficiency of 12% achievable by the spin coating method.

Photoresist

Spin Coating

10.1109/issm.1999.808782

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Extrusion Spin Coating: An Efficient and Deterministic Photoresist Coating Method in Microlithography

IEEE Transactions on Semiconductor Manufacturing (2004)

S. Han J. Derksen Jung‐Hoon Chun

Extrusion spin coating was developed to reduce photoresist waste and to improve coating uniformity in microlithography. This new method uses an efficient extrusion coating technique to apply a thin film of resist to a wafer prior to spinning. This initial layer of photoresist eliminates the spreading phase, the most inefficient step in conventional spin coating. The initial layer also provides existing spin coating models with preset initial conditions, allowing the prediction of coating thickness and uniformity a priori. This paper compares the experimental results with Emslie et al.'s predictive models of spin coating. A solvent concentration of 80% or higher in the coating chamber environment was found to be necessary to attain a predictable coating thickness with 5-/spl Aring/ uniformity. With optimized process variables, the mean coating thickness matched theoretical predictions within a variation of 0.01 /spl mu/m. Defect-free coating results were achieved with coating efficiencies as high as 40%.

Photoresist

Spin Coating

10.1109/tsm.2003.822734

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Citations (16)