Ming Qin

Southeast University

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i-10 index

Research Trends

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Document Type

Co-Authors

Qing‐An Huang

Southeast University

129

Zhenxiang Yi

Southeast University

Yizhou Ye

Chongqing University

Yan-Qing Zhu

Southeast University

Bing He

Baise University

Degui Li

Baise University

M.C. Poon

University of Toronto

Liuqing Liang

Baise University

Guang-Ping Shen

Inner Mongolia Medical University

Chunhua Cai

East China University of Science and Technology

Cooperative Institutions

Southeast University

101

Chinese Academy of Sciences

100

Zhejiang University

University of Chinese Academy of Sciences

Shanghai Jiao Tong University

Huazhong University of Science and Technology

Baise University

Central South University

University of Science and Technology Beijing

Tsinghua University

Author Statistics

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Research Field

A Fully Packaged CMOS Interdigital Capacitive Humidity Sensor With Polysilicon Heaters

IEEE Sensors Journal (2011)

Chenglong Zhao Ming Qin Qing‐An Huang

This paper presents a fully packaged CMOS interdigital capacitive humidity sensor with polysilicon heaters. The sensor was fabricated with the industrial standard CMOS process and the MEMS postprocessing step. Polyimide was used as the sensing material for its good linearity. To enlarge the depth of the recesses between the interdigital electrodes, the polysilicon heater was placed under the Al electrode and also the passivation between the interdigital electrodes was partly etched. As a result, thicker polyimide can be deposited between the Al electrodes and thus the sensitivity of the sensor can be improved. The etching resistant passivation between Al electrodes and polyimide was used to ensure the reliability of the sensor. To put it into practical use, the sensor was fully packaged, and by using the polysilicon heaters, both the hysteresis and the recovery time of the sensor could be greatly improved. The packaged humidity sensor was measured to show a good linearity and repeatability over the whole testing range.

Passivation

Linearity

10.1109/jsen.2011.2154325

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Citations (63)

An Efficient Macromodel Extraction Strategy for Packaged MEMS Thermal Wind Sensor Considering Multiphysics

IEEE Sensors Journal (2023)

Hao Xu Zhe Wang Zai‐Fa Zhou Zhenxiang Yi Ming Qin

This work presents a novel strategy for efficiently extracting macromodels from multiphysics microelectromechanical system (MEMS) devices with weak coupling. To validate the strategy, the packaged thermal wind sensor is chosen to verify the feasibility of the strategy for the first time. Based on the characteristics of the packaged thermal wind sensor, it can be divided into three distinct energy fields: thermal field, fluid field, and electric field. The packaged thermal wind sensor is initially built as the finite element model, which represents a pure thermal system under no wind flow conditions. Then, the thermal system with linear and time-invariant (LTI) is identified as a state space model by its step response obtained by transient simulation of the finite element model. Other energy fields can be regarded as negative inputs for the state space model. Subsequently, the macromodel is constructed by describing the relationship among thermal field, fluid field and electric field with Verilog-A. Remarkably, the macromodel based on this strategy takes into account geometric factors and material parameters. The tests show that the error of far group thermistors between system-level simulation and experiment is less than 5% under the conventional wind speed range on constant power (CP) mode, and the results of wind direction between them also show a significant degree of overlap. In brief, the strategy of extracting macromodel enables the direct construction of connections between the finite element model of MEMS devices and integrated circuits.

Multiphysics

10.1109/jsen.2023.3241645

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Citations (6)

Animal experimental study on the nerve root retraction with a silicon pressure sensor

Xing Liu Qing‐An Huang Ming Qin Hui Chen Darrin J. Young

For avoiding or reducing iatrogenic nerve faction impairment due to excessive nerve root retraction, a silicon piezoresistive pressure sensor is employed at the nerve root retractor, which would offer surgeons a numerical retraction reference and improve the performance of spine surgery. The sensor is used to measure the pressure exerted upon the retracted nerve root during animal experiments. Simultaneously, the experiments are monitored by electromyogram to get neuromuscular responses. The relationship between pressure exerted on the nerve root and corresponding neuromuscular responses would be founded by results of experiments, which could show that degree of nerve root damage impairment is positively correlated with nerve root retraction.

Retractor

Piezoresistive effect

Root (linguistics)

10.1109/transducers.2011.5969379

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Citations (1)

A hot film wind sensor with four Constant Temperature Difference elements fabricated on ceramic substrate

Ziqiang Dong Jingjing Chen Yukun Qin Ming Qin Qing‐An Huang

This paper presents a novel hot film wind sensor operating in Thermal-Balanced (TB) mode for the meteorological applications. The sensor is composed of four Constant Temperature Difference (CTD) elements, and each of the elements includes one heater and one temperature detector. The four CTD elements have been designed and implemented to heat the chip and keep itself at a constant overheat temperature higher than the airflow. Meanwhile, the elements are used to balance the temperature difference between the up-stream and down-stream CTD elements by controlling the heating power of the four heaters. The difference of the heating power between the up-stream and down-stream is a measure for the wind. The testing results indicate that the accuracies of the wind sensor are in the range of 0.5m/s and ±2° at wind speed ranging from 0m/s to 40m/s and wind direction from 0° to 360°, respectively.

CTD

Thermal wind

10.1109/icsens.2011.6126950

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Citations (11)

How to optimize transmission network

Telecom Engineering Technics and Standardization (2011)

Ming Qin

This article begins with a simple introduction of concepts and current development of transmission network,then based on the summary of acknowledgement of intranet,it raises questions that need to be considered for optimizing network transmission,meanwhile,it describes the main characters of current network.Next,by analyis of the need and problems concerning current national network,it comes up with the necessity and purpose to optimize network.and As soon as it brings up problems concerning current national network,it establishes the priciples to optimize network,and discusses the definition of every factor in network transmission.After that,this article discusses the realization of network optimization,which is also the main part of this article,it mainly gets started from clarification of the process to realize network optimization,and introduces every aspects of network optimization,in other words,it gets started from the examination affecting network and 3 key factors that forms network(network structure,transmission equipment,cable),to discuss the content of optimization.Finally,by combination of current situation of network and the development trend in the future,it provides some suggestions on how to realize network optimization.

Acknowledgement

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Citations (0)

Flip-chip on board packaging of a thermal wind sensor

Guang-Ping Shen Ming Qin Qing‐An Huang Hua Zhang Jian Wu

A two dimensional wind sensor was designed, fabricated and packaged on ceramic substrate instead of silicon substrate. The Ti/Pt heater and thermistors were fabricated using single lift-off process. The gold bumps were then sputtered and patterned on the chip using lift-off process again. Correspondingly, the Pb/Sn bumps were fabricated on the FR4 substrate using stencil printing method after metallization. The sensor chip was flip-chip packaged on the FR4 substrate, and the gap was filled with epoxy-based underfill to improve the structure strength and thermal isolation. The wind velocity and direction offsets of the sensor were analyzed and compensated using software and hardware calibration. The packaged sensor was tested in wind tunnel in constant power mode. Both the simulation and test results show that the thermal wind sensor can measure wind speeds up to 10m/s with an accuracy of 0.5m/s, and wind direction in a full range of 360° with a resolution within 5°.

Thermistor

10.1109/icept.2008.4606948

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Citations (2)

2-D Micromachined Thermal Wind Sensors—A Review

IEEE Internet of Things Journal (2014)

Yan-Qing Zhu Bei Chen Ming Qin Qing‐An Huang

This paper presents an overview and development of 2-D micromachined thermal wind sensors. It first compares different types of wind sensors, then gives a brief introduction to three basic measurement principles of the thermal wind sensors: hot-wire or hot-film, calorimetric, and time of flight. In order to have a good understanding of development of the 2-D micromachined thermal wind sensors, they are first categorized into thermoresistive, thermoelectric, and thermoelectronic wind sensors based on their operations. Then, each category is further divided into different subcategories, according to their measuring principles and sensor configurations. In Section IV, different materials, fabrication processes, packaging techniques, and control modes of the 2-D micromachined thermal wind sensors are analyzed. This paper also evaluates the core technologies on how to improve the sensitivity, measurement range, and power consumption of the thermal wind sensors.

Thermal wind

10.1109/jiot.2014.2319296

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Citations (99)

Study of the Piezoresistive Humidity Sensor

Dianzi qijian (2009)

Ming Qin

A humidity sensor which uses piezoresistive effect to detect the relative humidity was studied.Metal Al was used instead of heavy boron-doped layer to avoid negative piezoresistive effect at the turning of the piezoresistor.Ion implantation was used for fabricating the piezoresistor in order to obtain uniform B-doping and make the piezoresistors match better.The sensor was tested,the results show that the sensitivity of the sensor is 0.236 mV/%RH.The largest hysteresis is about 5%RH,the sensor also has good linearity.

Piezoresistive effect

Hysteresis

Linearity

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Citations (1)

Fluctuation-Suppression Pitch Control Strategy Study for Wind Turbine

Advanced materials research (2012)

Dong Li Ming Liao Ming Qin Li Xiang Sun

With the large-scale direction development of wind turbine, the vibrations of wind turbines, which are rigid-flexible coupled multi-body systems, can be easily excited. Control system can be improved to reduce the vibration amplitude and load levels. Fluctuation-suppression pitch control strategy has been improved in this paper. The reference input rotation speed, which is normally constant, is required to change with rotation acceleration in pitch control in this new control strategy. Theory and simulation show that Fluctuation-suppression pitch control (FSPC) strategy can improve the vibration characters of wind turbine and suppress rotation speed and power fluctuation, and it is also quite effective for gust situation

Pitch control

10.4028/www.scientific.net/amr.463-464.1605

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Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor

Yizhou Ye Zhenjun Wang Zhenxiang Yi Ming Qin Qing‐An Huang

In this paper, an annular-encapsulation packaging method is proposed to develop high-performance micromachined thermal wind sensor. The sensor used for demonstrating the feasibility of this design is composed of a central heater and eight thermistors. It measures the wind speed and direction through detecting the airflow-induced temperature distribution on the chip surface. Unlike the conventional self-packaging, epoxy resin is only utilized to encapsulate the bonding wires between the sensor pads and the PCB (print circuit board), while the front surface of the sensor is in contact with the air in this annular-encapsulation packaging. Based on this approach, the unwanted heat loss from the sensor to the epoxy resin is minimized, and more efficient heat exchange between the sensor and the airflow is realized via the backside of the chip. The experimental results show that the sensitivity of the sensor with this annular packaging at the wind speed 3.3m/s is 44.29 mv/ms ^-1 , achieving improvement of 50.8%, compared with the sensitivity 29.37 mV/ms ^-1 of the conventional self-packaged sensor.

Encapsulation

Thermistor

Flow sensor

10.1109/nems.2018.8557002

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Citations (3)