We report on the fabrication and measurement of hydrogen-terminated diamond field-effect transistors (FETs) incorporating V 2 O 5 as a surface acceptor material to induce transfer doping. Comparing a range of gate lengths down to 50 nm, we observe inversely scaling peak output current and transconductance. Devices exhibited a peak drain current of ~700 mA/mm and a peak transconductance of ~150 mS/mm, some of the highest reported thus far for a diamond metal semiconductor FET (MESFET). Reduced sheet resistance of the diamond surface after V 2 O 5 deposition was verified by four probe measurement. These results show great potential for improvement of diamond FET devices through scaling of critical dimensions and adoption of robust transition metal oxides such as V 2 O 5 .
Diamond is a semiconductor material with remarkable structural, thermal, and electronic properties that has garnered significant interest in the field of electronics. Although hydrogen (H) and oxygen (O) terminations are conventionally favored in transistor designs, alternative options, such as silicon (Si) and germanium (Ge), are being explored because of their resilience to harsh processing conditions during fabrication. Density-functional theory was used to examine the non-oxidized and oxidized group-IV (Si and Ge)-terminated diamond (100) surfaces. The (3 × 1) reconstructed surfaces feature an ether configuration and show relative stability compared with the bare surface. Hybrid-functional calculations of the electronic properties revealed reduced fundamental bandgaps (<1 eV) and lower negative electron affinities (NEAs) than those of H-terminated diamond surfaces, which is attributed to the introduction of unoccupied Si (Ge) states and the depletion of negative charges. Furthermore, oxidation of these surfaces enhanced the stability of the diamond surfaces but resulted in two structural configurations: ether and ketone. Oxidized ether configurations displayed insulating properties with energy gaps of ∼4.3 ± 0.3 eV, similar to H-terminated diamond (100) surfaces, whereas bridged ether configurations exhibited metallic properties. Oxidization of the metallic ketone configurations leads to the opening of relatively smaller gaps in the range of 1.1–1.7 eV. Overall, oxidation induced a shift from NEAs to positive electron affinities, except for the reverse-ordered ketone surface with an NEA of −0.94 eV, a value comparable to the H-terminated diamond (100) surfaces. In conclusion, oxidized group-IV-terminated diamond surfaces offer enhanced stability compared to H-terminated surfaces and display unique structural and electronic properties that are influenced by surface bonding.
We report a first-principles study of the structural and electronic properties of two-dimensional (2D) layer/hydrogen-terminated diamond (100) heterostructures. Both the 2D layers exhibit weak van-der-Waals (vdW) interactions and develop rippled configurations with the H-diamond (100) substrate to compensate for the induced strain. The adhesion energy of the hexagonal boron nitride (hBN) layer is slightly higher, and it exhibits a higher degree of rippling compared to the graphene layer. A charge transfer analysis reveals a small amount of charge transfer from the H-diamond (100) surface to the 2D layers, and most of the transferred charge was found to be confined within the vdW gap. In the graphene/H-diamond (100) heterostructure, the semi-metallic characteristic of the graphene layer is preserved. On the other hand, the hBN/H-diamond (100) heterostructure shows semiconducting characteristics with an indirect bandgap of 3.55 eV, where the hBN layer forms a Type-II band alignment with the H-diamond (100) surface. The resultant conduction band offset and valence band offset are 0.10 eV and 1.38 eV, respectively. A thin layer of hBN offers a defect-free interface with the H-diamond (100) surface and provides a layer-dependent tunability of electronic properties and band alignment for surface-doped diamond field effect transistors.
The ability to controllably tune cation valence state and resulting electrical conductivity of transition metal-oxides such as NiO is of great interest for a range of solid state electronic and energy devices and more recently in understanding electron correlation phenomena at complex oxide interfaces. Here, we demonstrate that it is possible to enhance electrical conductivity of NiO thin films by one order of magnitude by photoexcitation and three orders of magnitude by ozone treatment at as low as 310 K. The change occurs within nearly 2000 s and, thereafter, reaches a self-limiting value. A surprising difference is seen at 400 K: ultraviolet photon and ozone treatments cause only a marginal reduction in resistance in the first few minutes and, then, the resistance begins to increase and recovers its original value. This unusual reversal is explained by considering metastable incorporation of oxygen in NiO and oxygen equilibration with the environment. Variation in nickel valence state prior to and after photoexcitation and ozone treatment, investigated by x-ray photoelectron spectroscopy, provides mechanistic insights into resistance trends. This study demonstrates photon-assisted and ozone oxidation as effective low temperature routes to tune the electrical properties as well as metastably incorporate oxygen into oxides with direct influence on electrical conduction properties.
Optical properties and valence band density of states near the Fermi level of high-quality VO(2) thin films have been investigated by mid-infrared reflectometry and hard-UV (hν = 150 eV) photoemission spectroscopy. An exceptionally large change in reflectance from 2 to 94% is found upon the thermally driven metal-insulator transition (MIT). The infrared dispersion spectra of the reflectance across the MIT are presented and evidence for the percolative nature of the MIT is pointed out. The discrepancy between the MIT temperatures defined from the electrical and optical properties is found and its origin is discussed. The manifestation of the MIT is observed in the photoemission spectra of the V 3d levels. The analysis of the changes of the V 3d density of states is done and the top valence band shift upon the MIT is measured to be 0.6 eV.
Demonstration of three-dimensional all-solid-state Li-ion batteries (3D SSLIBs) has been a long-standing goal for numerous researchers in the battery community interested in developing high power and high areal energy density storage solutions for a variety of applications. Ideally, the 3D geometry maximizes the volume of active material per unit area, while keeping its thickness small to allow for fast Li diffusion. In this paper, we describe experimental testing and simulation of 3D SSLIBs fabricated using materials and thin-film deposition methods compatible with semiconductor device processing. These 3D SSLIBs consist of Si microcolumns onto which the battery layers are sequentially deposited using physical vapor deposition. The power performance of the 3D SSLIBs lags significantly behind that of similarly prepared planar SSLIBs. Analysis of the experimental results using finite element modeling indicates that the origin of the poor power performance is the structural inhomogeneity of the 3D SSLIB, coupled with low electrolyte ionic conductivity and diffusion rate in the cathode, which lead to highly nonuniform internal current density distribution and poor cathode utilization.