R. Arularasan

Sri Sivasubramaniya Nadar College of Engineering

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K. Babu

University of Hyderabad

R. Velraj

Anna University, Chennai

M. Purusothaman

Pokhara University

R. Edison chandraseelan

Intel (India)

Y.K. Sabapathy

Sri Ramachandra Institute of Higher Education and Research

Ganesan Dhanushkodi

Society for Applied Microwave Electronics Engineering & Research

Diwakar Suresh Babu

Sri Sivasubramaniya Nadar College of Engineering

S. Ramkumar

University Hospital Southampton NHS Foundation Trust

Cooperative Institutions

Sri Sivasubramaniya Nadar College of Engineering

Sri Ramachandra Institute of Higher Education and Research

Anna University, Chennai

Super Stars Literacy

Indian Institute of Technology Madras

Aeronautical Development Agency

University of Hyderabad

Koneru Lakshmaiah Education Foundation

Galgotias University

GS Engineering (United States)

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Thermally annealed biochar assisted nanofluid as quenchant on the mechanical and microstructure properties of AISI-1020 heat-treated steel—a cleaner production approach

Biomass Conversion and Biorefinery (2021)

R. Arularasan K. Babu

Carbon fibers

10.1007/s13399-021-01737-x

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Citations (5)

Preparation and characterization of Graphene nanofluids for immersion quenching

Materials Today Proceedings (2024)

Diwakar Suresh Babu R. Arularasan K. Babu

Immersion

10.1016/j.matpr.2024.05.161

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A Review on Optimization of Process Parameters of Abrasive Water jet Machining of Natural Fiber Based Polymer Composites

International Journal of Research in Advent Technology (2019)

M. Purusothaman R. Arularasan R. Edison chandraseelan

The need of modern machining technique like AWJM is inevitable to produce complex components in the field of automobile, aerospace, marine, chemical and power plant industries.Several components have been produced using FRPCs with many intrinsic features for variety of applications.However, the influence of various parameters of AWJM on material performance is found to be scanty, the performance of NFRPCs on AWJM process has not been explored exhaustively.Taking all these aspects into account, the current review formulates a study of the AWJM performance of various NFRCs such as banana, coconut sheath and jute with respect to varying factors and to find the optimum conditions for AWJM operation.There are so many process parameters which affect the quality of machined surface cut by AWJM.But, the traverse speed, hydraulic pressure, stand-off distance, Abrasive flow rate and type of abrasive and performance measures such as Material Removal Rate (MRR), Surface Roughness (SR), Kerf width, Depth of cut are considered important .

Water jet

Natural fiber

10.32622/ijrat.752019346

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Citations (2)

CFD ANALYSIS IN A HEAT SINK FOR COOLING OF ELECTRONIC DEVICES

The International Journal of the Computer, the Internet and Management (2008)

R. Arularasan

The reliability of electronic components is affected critically by the temperature at which the junction operates. As operating powers and speed increase, and as designers are forced to reduce overall system dimensions, the problems of extracting heat and controlling temperature can become crucial. The continuing increase of power densities in electronics packages and the simultaneous drive to reduce the size and weight of electronic products have led to an increased importance on thermal management issues in this industry. Plate fin heat sinks are commonly used devices for enhancing heat transfer in electronics components.. The choice of an optimal heat sink depends on a number of geometric parameters such as fin height, fin length, fin thickness, number of fins, base plate thickness, space between fins, fin shape or profile, material etc. Given a set of design constraints, one needs to determine the maximum possible performance of a heat sink within the constraints. Optimizing the above parameters to achieve low thermal resistance and low pressure drop is very difficult. In order to select the optimal geometric parameters of a heat sink for a particular application, a designer requires

Fin

Electronics cooling

Sink (geography)

Source

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Citations (27)

Modeling and simulation of a parallel plate heat sink using computational fluid dynamics

The International Journal of Advanced Manufacturing Technology (2008)

R. Arularasan R. Velraj

Electronics cooling

Microelectronics

10.1007/s00170-008-1867-9

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Citations (30)

Quenching performance of AISI 1010 in CNT nanofluids

Materials Today Proceedings (2017)

K. Babu R. Arularasan S. Ramkumar

Distilled water

10.1016/j.matpr.2017.08.065

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Citations (16)

Fabrication and Testing of FRP Open Coil Springs

Applied Mechanics and Materials (2014)

R. Arularasan Y.K. Sabapathy

Increasing competition and innovation in automobile sector tends to modify the existing products or replace old products by new and advanced material products. A suspension system of vehicle is also an area where these innovations are carried out regularly. Now days the automobile Industry has shown much interest in using Fiber Reinforced Plastic (FRP) components replacing conventional steel components due to its “high strength to low weight” ratio. Therefore replacement the steel open coil suspension springs (in heavy automobiles) with Glass Fiber Reinforced Plastic (GFRP) open coil springs with the main aim to reduce its weight and thereby reduce the fuel consumption to some extent. A semi mechanized pultrusion process (E –Glass and Epoxy Resin) and braiding process is selected for fabricating the GFRP open coil springs. It is then tested in lab to study some of the variable parameters. Keywords: Fiber reinforced plastic (FRP) , Coil spring , Pultrusion

Pultrusion

Coil spring

Suspension

10.4028/www.scientific.net/amm.592-594.1065

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Citations (5)

CFD simulation studies and experimental validation on a parallel plate heat sink

International Journal of Computer Aided Engineering and Technology (2011)

R. Arularasan Ganesan Dhanushkodi R. Velraj

The use of finned heat sinks in air cooled electronics components and assemblies increase the effective surface area for convective heat transfer, thereby, reducing the operating temperatures of these electronic devices. The objective of a heat sink is to achieve maximum heat dissipation, while restricting the consumption of valuable resources such as mass, fan power, pressure drop and space. Optimal design of the heat sink is a significant task. Therefore, preliminary studies on the heat transfer characteristics of a parallel plate heat sink have been carried. In this research work, the geometric parameters considered are fin height, fin thickness, base height and fin pitch. The simulation is carried out with a commercial computational fluid dynamics (CFD) package provided by Fluent Inc. Experimental validation of simulation results have been performed. In this study, the geometric parameters namely fin height, fin thickness, base height and fin pitch are found to be optimal at 48 mm, 3 mm, 4 mm and 3 mm respectively for an efficient heat sink design.

Fin

Electronics cooling

10.1504/ijcaet.2011.042361

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Citations (2)