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Toshikazu Satoh

Toyota Central Research and Development Laboratories (Japan)

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Masanori Usui

Toyota Central Research and Development Laboratories (Japan)

Toshitaka Ishizaki

Toyota Central Research and Development Laboratories (Japan)

Hisayoshi Fujikawa

Toyota Central Research and Development Laboratories (Japan)

Kunio Akedo

Toyota Central Research and Development Laboratories (Japan)

Tatsuo Mori

Aichi Institute of Technology

Kentaro Setsune

Panasonic (Japan)

Yasunori Taga

Chubu University

A. Kuno

Prince of Songkla University

Takao Nishikawa

Yamagata University

Makoto Wakasugi

Toyota Central Research and Development Laboratories (Japan)

Cooperative Institutions

Toyota Central Research and Development Laboratories (Japan)

Toyota Motor Corporation (Switzerland)

Nagoya University

The University of Tokyo

Osaka University

Tokyo Polytechnic University

Tohoku University

Panasonic (Japan)

Kyoto University

Hokkaido University

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Effect of zinc particle mixing on properties of copper–nanoparticle/bismuth–tin solder hybrid joints

Journal of Materials Science Materials in Electronics (2018)

Toshikazu Satoh Masanori Usui

Bismuth

Particle (ecology)

Volume fraction

10.1007/s10854-018-0175-x

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Citations (2)

Fabrication of ZnTe — Au composite microcrystallites utilizing island growth during thin film deposition

Thin Solid Films (1996)

Yasuhiko Takeda Toshikazu Satoh Tomoyoshi Motohiro Tatsumi Hioki Shoji Noda

Deposition

10.1016/0040-6090(95)08031-7

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Citations (3)

Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding

Microelectronics Reliability (2017)

Masanori Usui Toshikazu Satoh Hidehiko Kimura Satomi Tajima Yujiro Hayashi

10.1016/j.microrel.2017.07.096

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Citations (10)

Reliability of Cu Nanoparticles/Bi-Sn Solder Hybrid Bonding Under Cyclic Thermal Stresses

Masanori Usui Toshikazu Satoh Michiaki Kamiyama Hidehiko Kimura

Temperature cycling

10.1007/s11837-020-04521-w

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Citations (5)

Effect of high-temperature storage on the thermal conductivity of Cu nanoparticles/Bi-Sn hybrid bonding

Microelectronics Reliability (2021)

Masanori Usui Toshikazu Satoh

10.1016/j.microrel.2021.114407

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Citations (1)

Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles

Journal of Alloys and Compounds (2015)

Toshikazu Satoh Toshitaka Ishizaki

Non-blocking I/O

Bonding strength

Diffusion bonding

10.1016/j.jallcom.2014.12.224

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Citations (16)

X-ray photoelectron spectroscopy studies on amorphous TbFeCo alloy and polycarbonate interface

IEEE Transactions on Magnetics (1986)

Takehiko Yorozu Mitsuhiro Hirano K. Oka Toshikazu Satoh

Depth-profile of amorphous TbFeCo film sputtered onto polycarbonate substrate was studied by X-ray photoelectron spectroscopy. Oxidized metals, oxides and hydroxides for example, and adsorbed impurities were found to exist mainly in the vicinity of the film surface and film/substrate interface. Multiplet splitting of core-level spectra was also observed to estimate the degree of charge transfer from rare earth to transition metal. The splitting was identical with that of pure metal which indicates extremely small charge transfer.

Polycarbonate

10.1109/tmag.1986.1064323

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Photoemission Spectroscopy of the Interface between Indium-Tin-Oxide and Copper Phthalocyanine for Transparent Organic Light-Emitting Devices

Japanese Journal of Applied Physics (2001)

Noritake Isomura Toshikazu Satoh Motofumi Suzuki Takeshi Ohwaki Yasunori Taga

We investigated chemical and electronic structures of copper phthalocyanine (CuPc) for the electron-injection layer between indium tin oxide (ITO) and emission layers in transparent organic light-emitting devices (TOLEDs). Metallic Cu or dicopper oxide (Cu 2 O) is formed at the ITO/CuPc interface as a damaged layer during the sputtering deposition of ITO and plays a significant role in efficient electron injection from ITO to the emission layer. Sophisticated photoemission experiments revealed that the cause of the formation of the damaged layer is due to the exposure of CuPc to the oxygen plasma, while no significant damage is introduced by argon plasma and reaction with indium and tin atoms. To achieve efficient TOLEDs, the control of the oxygen plasma is essential.

Indium tin oxide

10.1143/jjap.40.l1038

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Citations (5)

Brass bonding using copper nanoparticles and zinc powder for packaging of power electronic devices

Journal of Alloys and Compounds (2019)

Toshikazu Satoh Yasuhiro Kume Masanori Usui

Brass

Electronic Packaging

10.1016/j.jallcom.2019.02.249

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Citations (4)

X-ray photoelectron spectroscopic study of the formation of Cu/Ni interface mediated by oxide phase

Journal of Alloys and Compounds (2013)

Toshikazu Satoh Kunio Akedo Toshitaka Ishizaki

Chemical state

Oxidation state

Inert gas

10.1016/j.jallcom.2013.08.042

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Citations (16)

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