A plasmonic modulator spanning both C- and O-band for dual-band data modulation up to 100 Gbit/s in one single device is presented. Fiber-to-fiber insertion loss can be as low as 11 dB.
We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency of −2.7 dB with −1.4 dB in simulations with the same coupling principle. Further, they offer a huge spectral window with a 3 dB passband of 350 nm. The technology relies on a vertically arranged layer stack, metal–insulator–metal waveguides, and fiber-to-slot couplers and is formed in only one lithography step with a minimum feature size of 250 nm. As an application example, we fabricate new modulator devices with an electro-optic organic material in the slot waveguide and reach 50 and 100 Gbit/s data modulation in the O- and C-bands within the same device. The devices' broad spectral bandwidth and their relaxed fabrication may render them suitable for experiments and applications in the scope of sensing, nonlinear optics, or telecommunications.
Metallic grating couplers can be extremely broadband and efficient. In this work, we investigate an all-plasmonic fiber-to-chip coupler with a coupling efficiency of -2.7 dB and an optical 3-dB passband of 300 nm.
