Summary form only. An abstract of the above-titled article, taken from the 1963 IEEE International Convention (held March 25-28, New York, NY, USA), is presented.
A case history of the design, development, and production of a commercial, high-performance multichip module at NCR Corporation is presented. Included is a brief description of NCR's strategy followed by design and manufacturing considerations encountered in the development of a tape automated bonded (TAB) module for volume production. These considerations include everything from developing sources for the components, to design for manufacturability requirements.< >
Summary - A new packaging concept for microelectronics and its application to a digital system are presented. The concept utilizes the new Dot components mounted in ceramic wafers. Dot components are disks 0.03-in thick with a diameter as small as 0.05-in. Connections to components are made by multi-layer deposition techniques; and connections to wafer modules, by a novel pressure connection method. A unique and compact heat transfer scheme is described. The design example contains 2260 of the smallest Dot components in an approximately 1. 25-in cube. The component density of the package (including all thermal, interconnection, and structural provisions) is 1,960,000 per cubic foot (1130 per cubic inch). The package provides excellent temperature control for the components and is sufficiently rugged to withstand space environments. A photograph of model hardware is shown.
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