Li‐Na Mao

Hefei University of Technology

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Fang‐Qiu Zu

Hefei University of Technology

Chengming Hu

Wuhan Polytechnic University

Zhongyue Huang

Fudan University

Yun Xi

Sun Yat-sen University

J. Chen

Hefei University of Technology

Y. C. Liu

Hefei University of Technology

Jin Yu

Southeast University

Yong-Chi Liu

Hefei University of Technology

Yuanxing Li

Hefei University of Technology

L.J. Liu

Beijing Institute of Technology

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Hefei University of Technology

Chinese Academy of Sciences

Sun Yat-sen University

Third Affiliated Hospital of Sun Yat-sen University

Ministry of Education of the People's Republic of China

Northwest University

Southeast University

Shanghai University of Engineering Science

Zhejiang Lab

Shanghai University

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A new viewpoint to the mechanism for the effects of melt overheating on solidification of Pb-Bi alloys

Journal of materials research/Pratt's guide to venture capital sources (2009)

Fang‐Qiu Zu Jie Chen Yuanxing Li Li‐Na Mao Yong-Chi Liu

Overheating (electricity)

Supercooling

10.1557/jmr.2009.0294

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Citations (21)

Influence of temperature-induced liquid–liquid structure transition on directional solidification microstructure of Sn–Bi40wt-% alloy

Physics and Chemistry of Liquids (2010)

L.J. Liu M.Q. Liu Fang‐Qiu Zu Zhongyue Huang Chengming Hu

Prior investigation suggested that a temperature-induced liquid–liquid structure transition (TI-LLST) could occur in Sn–Bi40wt-% alloy around 879°C. Based on the results of TI-LLST, the Sn–Bi40wt-% alloys are melted and held at the temperature above and below TI-LLST, respectively, and then solidified from the same temperature. The aim of this work was to explore the influence of TI-LLST on directional solidification microstructure by using the Bridgman method. The results show that dendritic arm spacing decreases and the microstructure is refined markedly for the samples solidified from the melt which experienced the TI-LLST.

Directional solidification

Transition temperature

10.1080/00319100902839152

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Citations (1)

Effects of liquid–liquid transition on solidification of Sb–10 wt-%Cu alloy

Materials Science and Technology (2010)

Fang‐Qiu Zu Li‐Na Mao Chengming Hu J. Chen Zhongyue Huang

The electrical resistivity of the liquid Sb–10 wt-%Cu alloy as a function of temperature was measured using direct current four probe technique. In a relatively high temperature zone above the liquidus, the resistivity–temperature ( ρ – T ) curves of the melt change abnormally; moreover, the changing pattern in the first heating process is completely different from the ones in the subsequent heating and cooling cycles. Since resistivity is a structural sensitive parameter, these abnormal changes of ρ – T curves indicate that the temperature-induced liquid–liquid structure transitions (L-LSTs) probably occur in Sb–10 wt-%Cu melt, with some reversible characters. To explore the effects of the L-LST on the solidification behaviours and solidified microstructures of this alloy, solidification experiments were further carried out according to the temperature ranges with anomalous changes on ρ – T curves. Results show that after the melt experienced the L-LST, larger undercooling, shorter solidified time and much finer microstructures with differently microscopic patterns could be obtained.

Liquidus

Supercooling

Cooling curve

10.1179/174328409x410917

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Investigation of the Relationship of the Melt Structures and Solidification Behaviors of Cu‐Sb70 Alloy Explored by Electrical Resistivity Method

Yun Xi Jin Yu Li‐Na Mao Fang‐Qiu Zu

This chapter contains sections titled: Introduction Experiment Experimental results Discussion Conclusions

10.1002/9781118359341.ch25

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