Organic electronic devices have lately attracted much attention as viable alternatives to inorganic ones. Neither high temperature steps nor expensive deposition equipments are required to fabricate competitive organic devices. Low cost, lightness and flexibility are some of the advantages in these novel devices. This paper briefly reviews some successful results on this new research area, particularly on organic thin film transistors and solar cells.
The interdigitated back-contacted (IBC) solar cell concept has been extensively studied for single-junction cells and more recently as a good choice for three-terminal tandem devices. In this work, carrier-selective contacts based on transition metal oxides deposited by atomic layer deposition (ALD) technique are applied to IBC c-Si(n) devices. In the first part of the study, we develop a hole-selective contact based on thin ALD vanadium oxide (V2O5) layers without using an amorphous silicon interlayer. The ALD process has been optimised, i.e. number of ALD cycles and deposition temperature, as a trade-off between surface passivation and contact resistivity. Noticeable surface passivation with recombination current densities around 100 fA/cm2, as well as reasonable contact resistivity values below 250 mΩcm2 are reached using 200 ALD V2O5 cycles deposited at a deposition temperature of 125 °C (∼10 nm layer thickness). The optimised ALD V2O5-based contact is combined with both an ALD TiO2-based electron-selective contact and an excellent surface passivation in non-contacted regions provided by ALD Al2O3 films, to form a fully ALD IBC c-Si(n) solar cell scheme. Fabricated devices yield photovoltaic efficiencies and pseudo efficiencies, i.e. calculated without series resistance losses, of 18.6% and 21.1% respectively (3 cm × 3 cm device area). These results reveal the potential of the ALD technique to deposit transition metal oxide (TMO) films as selective contacts on high efficiency devices, paving the way of using low thermal-budget, low cost and highly scalable processes for a highly demanding IBC solar cell architecture in the photovoltaic industry.
A completely dry low-temperature process has been developed to passivate 3.3 Ω cm p-type crystalline silicon surface with excellent results. Particularly, we have investigated the use of a hydrogen plasma treatment, just before hydrogenated amorphous silicon carbide (a-SiCx:H) deposition, without breaking the vacuum. We measured effective lifetime, τeff, through a quasi-steady-state photoconductance technique. Experimental results show that hydrogen plasma treatment improves surface passivation compared to classical HF dip. Seff values lower than 19 cm s−1 were achieved using a hydrogen plasma treatment and an a-SiCx:H film deposited at 300 °C.
In this work, we have fabricated and studied p-type picene thin-film transistors. Although the devices exhibited good electrical performance with high field-effect mobility (up to 1.3 cm 2 /V·s) and on/off ratios above 10 5 , the output electric characteristics of the devices exhibited a Negative Differential Resistance for higher drain-source voltage. Finally, a possible explanation for this phenomenon is developed.