Heyi Wang

City University of Hong Kong

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Chengjian Xiao

China Academy of Engineering Physics

Jiamao Li

Anhui University of Technology

Linjie Zhao

China Academy of Engineering Physics

Guangming Ran

China Academy of Engineering Physics

Zhilin Chen

China Academy of Engineering Physics

Jingwei Hou

China Academy of Engineering Physics

Yu Gong

Shanghai Institute of Applied Physics

Xiaolong Fu

China Academy of Engineering Physics

Chao Chen

Southwest Petroleum University

Yang Lü

University of Hong Kong

Cooperative Institutions

Chinese Academy of Sciences

113

China Academy of Engineering Physics

110

City University of Hong Kong

University of Science and Technology of China

University of Chinese Academy of Sciences

Institute of Plasma Physics

Hefei Institutes of Physical Science

City University of Hong Kong, Shenzhen Research Institute

Southwestern Institute of Physics

Sichuan University

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Tuning diamond electronic properties for functional device applications

Functional Diamond (2022)

Anliang Lu Limin Yang Chaoqun Dang Heyi Wang Yang Zhang

Because of its ultrahigh hardness, synthetic diamond has been widely used in advanced manufacturing and mechanical engineering. As an ultra-wide bandgap semiconductor, on the other hand, diamond recently shows a great potential in electronics industry due to its outstanding physical properties. However, like silicon-based electronics, the electrical properties of diamond should be well modulated before it can be practically used in electronic devices. In this work, we briefly review the recent progresses in producing high-quality, electronic grade synthetic diamonds, as well as several typical strategies, from the conventional element doping to the emerging "elastic strain engineering," (ESE) for tuning the electrical and functional properties of microfabricated diamonds. We also briefly show some device application demonstrations of diamond and outline some remaining challenges that are impeding diamond's further practical applications as functional devices and offer some perspective for future functional diamond development.

Strain engineering

10.1080/26941112.2022.2151322

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Citations (4)

Interlocked wood-like composites with tunable mechanical properties

Journal of the Mechanics and Physics of Solids (2024)

Hui Liu Xu Wang Lei Wan Juan Hao Yu‐Jie Zhong

10.1016/j.jmps.2024.105679

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Citations (2)

In-situ tritium release behavior and post-irradiation experiments of Li2TiO3 pebbles developed by freeze-drying method

Fusion Engineering and Design (2023)

Linjie Zhao Mao Yang Chengjian Xiao Jiamao Li Lei Yue

Breeder (animal)

Fusion power

10.1016/j.fusengdes.2023.113956

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Citations (2)

Hierarchical crystalline–amorphous nanocomposites with high strength and large deformability enabled by elemental diffusion

Journal of Material Science and Technology (2023)

Liqiang Wang Heyi Wang Xin Zhou Huangliu Fu James Utama Surjadi

Nanocrystalline material

Amorphous carbon

Deformation mechanism

10.1016/j.jmst.2023.06.046

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Citations (7)

Diamond semiconductor and elastic strain engineering

Journal of Semiconductors (2022)

Chaoqun Dang Anliang Lu Heyi Wang Hongti Zhang Yang Lü

Abstract Diamond, as an ultra-wide bandgap semiconductor, has become a promising candidate for next-generation microelectronics and optoelectronics due to its numerous advantages over conventional semiconductors, including ultrahigh carrier mobility and thermal conductivity, low thermal expansion coefficient, and ultra-high breakdown voltage, etc. Despite these extraordinary properties, diamond also faces various challenges before being practically used in the semiconductor industry. This review begins with a brief summary of previous efforts to model and construct diamond-based high-voltage switching diodes, high-power/high-frequency field-effect transistors, MEMS/NEMS, and devices operating at high temperatures. Following that, we will discuss recent developments to address scalable diamond device applications, emphasizing the synthesis of large-area, high-quality CVD diamond films and difficulties in diamond doping. Lastly, we show potential solutions to modulate diamond’s electronic properties by the “elastic strain engineering” strategy, which sheds light on the future development of diamond-based electronics, photonics and quantum systems.

Strain engineering

Microelectronics

Nanoelectromechanical systems

10.1088/1674-4926/43/2/021801

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Citations (29)

Radiation-induced defects in different silicon (111) wafers by 400 keV electron irradiation

Rare Metals (2012)

Hui Gao Heyi Wang Yonggang Yuan

Electron beam processing

Photoelectric effect

10.1007/s12598-012-0508-5

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Context contribution to the intermolecular recognition of human ACE2-derived peptides by SARS-CoV-2 spike protein: implications for improving the peptide affinity but not altering the peptide specificity by optimizing indirect readout

Molecular Omics (2020)

Peng Zhou Heyi Wang Zheng Chen Qian Liu

Severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) is an etiological agent of the current rapidly growing outbreak of coronavirus disease (COVID-19), which is straining health systems around the world. Disrupting the intermolecular association of SARS-CoV-2 spike glycoprotein (S protein) with its cell surface receptor human angiotensin-converting enzyme 2 (hACE2) has been recognized as a promising therapeutic strategy against COVID-19. The association is a typical peptide-mediated interaction, where the hACE adopts an α1-helix, which can form a two-helix bundle with the α2-helix, to pack against a flat pocket on the S protein surface. Here, we demonstrate that the protein context of full-length hACE plays an essential role in supporting the hACE2 α1-helix recognition by viral S protein. Energetic analysis reveals that the α1-helical peptide (αHP) and also the two-helix bundle peptide (tBP) cannot bind effectively to S protein when they are split from the hACE protein. The context contributes moderately and considerably to the direct readout (DR) and indirect readout (IR) of peptide recognition, respectively. Dynamics simulation suggests that the two free peptides exhibit a large intrinsic disorder without the support of protein context, which would incur a considerable entropy penalty upon binding to S protein. To restore the IR effect lost by splitting peptides from hACE, we herein propose employing hydrocarbon stapling and cyclization strategies to constrain the free αHP and tBP peptides into their native ordered conformations, respectively. The stapling and cyclization are carefully designed in order to avoid influencing the peptide DR effect, which has been demonstrated to improve the peptide binding affinity (but not specificity) to S protein. The stapling/cyclization-imposed conformational constraint can effectively minimize the unfavorable IR effect (i) by reducing the peptide flexibility and entropy cost upon their binding to S protein, and (ii) by helping peptide pre-folding into their native state to facilitate the conformational selection by S protein.

Oligopeptide

10.1039/d0mo00103a

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Citations (47)

Current Progress of Tritium Fuel Cycle Technology for CFETR

Journal of Fusion Energy (2018)

Xiaolin Wang Guangming Ran Heyi Wang Chengjian Xiao Guikai Zhang

Fusion power

10.1007/s10894-018-0158-1

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Citations (41)

Methane decomposition over high-loaded Ni-Cu-SiO2 catalysts