Anmou Liao

Institute of Microelectronics

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Wei Li

Kunming Medical University

Zhenyu Wang

North University of China

Xiaobin Zhang

Beihang University

Yunqian Song

Institute of Microelectronics

Xiaoliang Zhao

Xi’an University

Lijun Zhang

Shaanxi University of Technology

Yun Wang

Microsoft Research (United Kingdom)

Lijun Zhang

China University of Petroleum, East China

Yujun Wang

Chinese Academy of Sciences

Yun Wang

Commercial Aircraft Corporation of China (China)

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Chinese Academy of Sciences

Institute of Microelectronics

University of Chinese Academy of Sciences

Peking University

Research Institute of Petroleum Exploration and Development

Central South University

State Key Laboratory of Oil and Gas Reservoir Geology and Exploitation

Tongji University

Southeast University

Soochow University

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Ultra-thermostable embedded liquid cooling in SiC 3D packaging power modules of electric vehicles

Energy Conversion and Management (2022)

Xiaobin Zhang Xiaoliang Zhao Wei Li Zhenyu Wang Anmou Liao

dBc

Power module

Computer cooling

Power density

10.1016/j.enconman.2022.116499

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Reliability Inspection for Bilayer Nanosilver Paste Ensemble Pressureless Sintered Embedded Cooling SiC Power Module

IEEE Transactions on Components Packaging and Manufacturing Technology (2023)

Xiaobin Zhang Xiaoliang Zhao Wei Li Zhenyu Wang Anmou Liao

Various hollowing substrates have been invented to equipped in the embedded cooling power modules. Through a lower stress residue, multilayer nanosilver paste ensemble pressureless sintering to obtain the qualified thermal interface material (TIM) joints becomes an essential process for those fragile stacking packages. As the Anand viscoelastic constitutive model prediction, the maximum residual stress inside the TIM joints is only 63.18 MPa, far below the encapsulated materials’ tensile strengths. From all the scanning electron microscope (SEM), X-ray, and scanning acoustic microscope (SAM) image investigations, the upper and beneath nanosilver paste ensemble pressureless sintered TIM joints (50

$\pm ~10~\mu \text{m}$

thickness) contained few cracks and delamination (only 1.6% ± 0.1% and 8.5% ± 0.1% void ratios, respectively). The measured upper and beneath sintered TIM joints’ bond strengths were up to 38 ± 2 and 63.8 ± 2 MPa, higher than the industry requirement (30 MPa), respectively. After 21 000 power cycles, the upper and beneath sintered TIM joints’ thermal resistance increased only by 10.3% and 5.3%, far underneath the failure standard (20%), respectively. This presented multilayer nanosilver paste ensemble pressureless sintering process is a promising technology for the embedded cooling power module stacking package.

10.1109/tcpmt.2023.3243737

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Citations (6)