Shou-Yi Chang

National Tsing Hua University

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Su-Jien Lin

National Tsing Hua University

Yi-Chung Huang

National Chung Hsing University

Jien‐Wei Yeh

National Tsing Hua University

Jenq‐Gong Duh

National Tsing Hua University

Chi-Huan Tung

Oak Ridge National Laboratory

Wei‐Ren Chen

Oak Ridge National Laboratory

Fuh‐Sheng Shieu

National Chung Hsing University

Changwoo Do

Oak Ridge National Laboratory

Su-Yueh Tsai

National Tsing Hua University

Zih-You Wu

National Tsing Hua University

Cooperative Institutions

National Tsing Hua University

153

National Chung Hsing University

107

National Yang Ming Chiao Tung University

National Taiwan University

Industrial Technology Research Institute

National Cheng Kung University

National Synchrotron Radiation Research Center

National Central University

National Taipei University

University of Michigan–Ann Arbor

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Chemical complexity-changed deformation behavior of NiTi-based B2 low- to high-entropy intermetallic compounds: Atomistic simulations

Journal of Alloys and Compounds (2023)

Cheng-Yuan Tsai Chi-Huan Tung Chuncheng Chen Shou-Yi Chang

Diffusionless transformation

Shearing (physics)

Nickel titanium

10.1016/j.jallcom.2023.171557

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Citations (2)

5 nm-Thick (AlCrTaTiZrRu)N<SUB>0.5</SUB> Multi-Component Barrier Layer with High Diffusion Resistance for Cu Interconnects

Nanoscience and Nanotechnology Letters (2011)

Shou-Yi Chang Wang Chen-yuan Chen-En Li Yi-Chung Huang

Diffusion barrier

Component (thermodynamics)

Barrier layer

10.1166/nnl.2011.1155

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Citations (17)

Effect of NH3/He Plasma Treatment on Electromigration Behavior and Electrical Reliability of Copper Interconnects

ECS Transactions (2009)

Shou-Yi Chang Fong-Jie Lin Chia-Feng Lin

Electromigration reliability tests of Cu interconnect structures with or without an NH3/He plasma treatment have been performed in this study at 400oC under a high current density of 8 MA/cm2 to clarify the effect of plasma treatment on the interface structure, early-stage electromigration behavior and electrical reliability of interconnects. From cumulative failure probabilities, small shape factors and large median time to failure were obtained for the interconnects with the plasma treatment, indicating an improved electromigration resistance. The oxide layer on Cu surface was removed, and an alternative CuSiN interlayer with a lattice spacing of 0.195 nm formed at the Cu/SiCN interface, enhancing interface adhesion and reducing the diffusion paths of Cu atoms. Therefore, voids nucleated inside the Cu wires, rather than at the interface. The change in the Cu/SiCN interface structure varied the early-stage electromigration-induced voiding behavior and effectively improved the electrical reliability of the Cu interconnect structures.

Electromigration

10.1149/1.3122133

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Citations (0)

Effect of substrate bias on the microstructure and properties of (AlCrSiNbZr)Nx high entropy nitride thin film

Surface and Coatings Technology (2020)

Jianjie Wang Shou-Yi Chang Fan-Yi Ouyang

Biasing

10.1016/j.surfcoat.2020.125796

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Citations (30)

Effect of plasma treatments on interface chemistry and adhesion strength between porous SiO2 low-k film and SiC/SiN layers

Microelectronic Engineering (2007)

Shou-Yi Chang Yi-Chung Huang

Low-k dielectric

Delamination

10.1016/j.mee.2007.07.007

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Citations (9)

Effect of Plasma Treatment on Ice Plant Germination and Physicochemical Surface Using Dielectric Barrier Discharge

IEEE Transactions on Plasma Science (2023)

Tzu-Ling Chen Yuan‐Tai Lai Sheng-Yu Hsu Shou-Yi Chang Hsueh-Hsing Hung

Atmospheric pressure plasma treatment on seeds has recently become a valuable technique to improve germination. This work treated Mesembryanthemum crystallinum (ice plant) seeds by the dielectric barrier discharge (DBD) atmospheric pressure plasma at room temperature. Fourier transform infrared spectroscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS) indicate that after plasma treatment, the N–H stretching vibration of proteins (

$\sim 3340$

$^{-1}$

) is introduced into the seed surface, increasing the nitrogen content on the surface of the ice plant. Therefore, the seed germination rate increased significantly by 15.2%. However, prolonged plasma treatment reduces seed germination. Because the operating surrounding temperature increases with the treatment time, the wax on the surface of the seed is evaporated, resulting in a significant increase water uptake of seeds. Excess water uptake hinders oxygen diffusion to the embryo, affecting germination. A feasible mechanism and effects of plasma treatment on ice plants are proposed in this study. DBD plasma-treated ice plants significantly increase germination rates, showing excellent potential in the agricultural field.

Plasma actuator

10.1109/tps.2023.3234963

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Citations (0)

Microstructure characterization of Alx CoCrCuFeNi high-entropy alloy system with multiprincipal elements

Metallurgical and Materials Transactions A (2005)

C. H. Tong Yuliang Chen Jien‐Wei Yeh Su-Jien Lin Swe-Kai Chen

High-Entropy Alloys

Spinodal decomposition

Differential thermal analysis

10.1007/s11661-005-0283-0

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Citations (1,087)

Grain Modification and Formation of Tough Imc Phase in Submicron Sn-Ag Microbumps Via Doping Zn and Ni in Cu Substrate

Yin-Ku LEE Zih-You Wu Pin-Wei Huang Chen-Sung Chao Su-Yueh Tsai

For the advanced 2.5D/3D IC applications, the IMCs suppression and phase stability should be emphasized. The novel Cu-26Zn-18Ni/Sn-3.5Ag/Cu-26Zn-18Ni (by weight) microbumps have been fabricated and the considerable inhibition on the IMCs and void formation was investigated. Four kinds of IMC were found: (Cu,Ni)6(Sn,Zn)5, (Cu,Ag)5(Sn,Zn)8, Ag3Sn and (Cu,Ni)Zn in Cu-26Zn-18Ni/Sn-3.5Ag/Cu-26Zn-18Ni microbumps. The tough bulk (Cu,Ag)5(Sn,Zn)8 combined refined (Cu,Ni)6(Sn,Zn)5 grains and void-free microstructure were expected to enhance the reliability of microbumps. The effect of Ag on the formation of tough (Cu,Ag)5(Sn,Zn)8 is also addressed. These findings provided insights into the design of substrate alloy in advanced electronic packaging reliability.

10.2139/ssrn.4526567

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Citations (0)

The effect of carbon containing atmosphere on the structure and mechanical properties of Fe-32Mn-9.4Al-1C-1.27Si alloy

Journal of Materials Science (1996)

J. Y. Liu Shou-Yi Chang

Carbon fibers

10.1007/bf00352682

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Citations (2)

Formation of Free-Standing Inverse Opals with Gradient Pores

Nanomaterials (2020)

Pei-Sung Hung Chen-Hong Liao Bo-Han Huang Wei-An Chung Shou-Yi Chang

We demonstrate the fabrication of free-standing inverse opals with gradient pores via a combination of electrophoresis and electroplating techniques. Our processing scheme starts with the preparation of multilayer colloidal crystals by conducting sequential electrophoresis with polystyrene (PS) microspheres in different sizes (300, 600, and 1000 nm). The critical factors affecting the stacking of individual colloidal crystals are discussed and relevant electrophoresis parameters are identified so the larger PS microspheres are assembled successively atop of smaller ones in an orderly manner. In total, we construct multilayer colloidal crystals with vertical stacking of microspheres in 300/600, 300/1000, and 300/600/1000 nm sequences. The inverse opals with gradient pores are produced by galvanostatic plating of Ni, followed by the selective removal of colloidal template. Images from scanning electron microscopy exhibit ideal multilayer close-packed structures with well-defined boundaries among different layers. Results from porometer analysis reveal the size of bottlenecks consistent with those of interconnected pore channels from inverse opals of smallest PS microspheres. Mechanical properties determined by nanoindentation tests indicate significant improvements for multilayer inverse opals as compared to those of conventional single-layer inverse opals.

Colloidal crystal

Polystyrene

10.3390/nano10101923

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Citations (45)