We report the observation of a large anisotropic magnetoresistance (AMR) and planar Hall effect (PHE) in a topological superconducting candidate Cu0.05PdTe2. The AMR and PHE data in Cu0.05PdTe2 can be well explained by the semiclassical theory, confirming that the magneto-transport behaviors of the Cu0.05PdTe2 superconductor are related to its topological nature. The AMR ratio in Cu0.05PdTe2 is one order of magnitude larger than those in traditional ferromagnetic metals. The present results suggest that Cu0.05PdTe2 is a promising material in future magnetoresistive devices with low power consumption.
Using liquid oxygen carriers is an inventive promising alternative to solving the problems of wear and sintering caused by solid oxygen carriers in chemical looping gasification (CLG). Bismuth oxide (Bi 2 O 3 ) and Antimony oxide (Sb 2 O 3 ) were selected as liquid oxygen carriers, and the kinetics of liquid chemical looping gasification (LCLG) of cellulose (CE) was analyzed by thermogravimetric analysis. Samples of CE-oxygen carriers were prepared with different mixing ratios, and thermogravimetric experiments were carried out at different heating rates. The apparent activation energies of CE, CE/Bi 2 O 3 -10, CE/Bi 2 O 3 -30 and CE/Bi 2 O 3 -50 were 181.93, 155.72, 179.50, and 170.47 kJ·mol -1 , respectively. The apparent activation energies of CE/Sb 2 O 3 -10, CE/Sb 2 O 3 -30 and CE/Sb 2 O 3 -50 were 179.40, 152.89 and 129.55 kJ·mol -1 , respectively. The results showed that Bi 2 O 3 could significantly reduce the activation energy of CE gasification, which had better performance as a liquid oxygen carrier than Sb 2 O 3 . When the mass fraction of Bi 2 O 3 was 10%, the lowest average activation energy was 155.72 kJ·mol -1 .
Under the engineering background of the carbon dioxide capture and geological storage technology (CCUS) cementing project, an experiment on the generation of cement single-phase tricalcium silicate CO 2 carbonization products were carried out. Combining the phase diffraction pattern data and the thermogravimetric experiment, a relative crystallinity algorithm is proposed, which combines the quantitative results of the carbonized products with the relative crystallinity (RCP) results of each component. The growth and development mechanism of tricalcium silicate carbide crystal products under high temperature, high pressure and high concentration CO 2 environment is deduced. The experimental results show that under the conditions of early gas phase carbonization, the carbonization rate of C 3 S first increases and then decreases as the carbonized crystal product grows. Under the conditions of early liquid phase carbonization, the carbonization rate of C 3 S first decreases and then increases with the generation and fragmentation of the hydration barrier layer. It provides a research basis and a new perspective for the subsequent analysis of the changes in the microstructure of the cement paste in the carbonization process under the CCUS engineering background.
Copper-based materials play a vital role in the electrochemical transformation of CO 2 into C 2 /C 2+ compounds. In this study, cross-sectional octahedral Cu 2 O microcrystals were prepared in situ on carbon paper electrodes via electrochemical deposition. The morphology and integrity of the exposed crystal surface (111) were meticulously controlled by adjusting the deposition potential, time, and temperature. These cross-sectional octahedral Cu 2 O microcrystals exhibited high electrocatalytic activity for ethylene (C 2 H 4 ) production through CO 2 reduction. In a 0.1 M KHCO 3 electrolyte, the Faradaic efficiency for C 2 H 4 reached 42.0% at a potential of −1.376 V vs. RHE. During continuous electrolysis over 10 h, the FE (C 2 H 4 ) remained stable around 40%. During electrolysis, the fully exposed (111) crystal faces of Cu 2 O microcrystals are reduced to Cu 0 , which enhances C-C coupling and could serve as the main active sites for catalyzing the conversion of CO 2 to C 2 H 4 .
Because of higher assembling density, better electrical and mechanical performances and higher reliability than other package styles, more and more BGA package styles are widely and successfully used. Micro crack induced by process stress becomes one of the critical factors which affect yield and long term reliability of BGA solder joints. It becomes more serious with the application of lead free soldering because lead free solder alloy have higher stiffness and lower ductibility compared with the traditional SnPb solder alloy. So Pb-free boards are more susceptible to pad crater micro crack due to flexure for shocking and manufacturing compared with SnPb boards. The long-term reliability of BGA joints may be greatly decreased due to the crack in the BGA joints. Up to now, crack mechanism and how to reduce crack have not be fully understood. The possible reasons which may introduce the crack are investigated in this paper. The various process stresses during the process of assembly or handling PCB are focused on in this paper. A practical computer main board with a CPU BGA often fails due to micro crack. To aim at this problem, three experiments are designed and tested under different operation manners and processes situation with the application of strain gage. First, the strains of CPU socket result from in-circuit tests are measured under different test times. The results show the micro crack is the potential risk according to Intel company's acceptance criterion. Second, the strains generated from process stress of handing PCB are measured and compared with various handling manners. Result shows improper operation manner introduce micro crack directly. Third, the process stress results from installing battery and PC card are also reviewed. To deal with these problems, a novel integrative solution with optimal test fixture clamp and setup, proper handing manner, reasonable integration method and setup is planned and verified. Experimental data shows no strains exceed the acceptance criterion. From the above experimental results, ICT process, mechanical assembly process, functional test, handing PCB are the main source of excess process stresses which induce micro crack. Adhesive application as an additional method is investigated. This method proves to be an effective way to reduce the strain; as a result, crack in the BGA joints may be largely reduced or even eliminated effectively. These experimental results can provide useful guidance to the practical manufacturing process. More researches on crack should be conducted to reduce crack and improve the long-term reliability of BGA
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