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Yam Lip Huei
Yam Lip Huei
Materials science
Soldering
Composite material
Bumping
Solder paste
4
Papers
2
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0
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Advanced No-Clean Solder Paste for SIP applications
2020
Santosh Kumar Rath
Yam Lip Huei
Sylvia Sutino
Chieng Yu Yuan
Senthil Kumar Balasubramanian
Yee Ting Lo
Joel Agala
Hanwen Zhang
Li-san Chan
Sungsig Kang
Stefan Mausner
Sebastian Fritzsche
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Characterization of Coating on Fine Interconnect Materials
2019
EPTC | Electronics Packaging Technology Conference
Yam Lip Huei
Sarangapani Murali.
Joel Agala
Lo Miew Wan
Wong Chin Yeung Jason
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