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Co van Veen
Co van Veen
Philips
Soldering
Engineering
Chip
Electronic engineering
Computer science
5
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3
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Collapse of a liquid solder bump under load1
2016
THERMINIC | International Workshop on Thermal Investigations of ICs and Systems
Co van Veen
Wendy Luiten
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Citations (1)
Wireless Sensor Systems – The e‐CUBES Project
2008
Adrian M. Ionescu
Eric Beyne
Tierry Hilt
Thomas Herndl
Pierre Nicole
Mihai A. T. Sanduleanu
Anton Sauer
Herbert Shea
Maaike M. Visser Taklo
Co van Veen
Josef Weber
Werner Weber
Jürgen Wolf
Peter Ramm
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Citations (1)
Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP's
2004
Journal of microelectronics and electronic packaging
Co van Veen
Bart Vandevelde
Eric Beyne
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IC Packaging for Miniaturised Consumer Electronics
1998
Co van Veen
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