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Takeshi Nokuo

JEOL Ltd.

53

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Investigation of continuous deformation behavior around initial yield point of single crystal copper by using micro scale torsion test

2016 Scripta Materialia
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Scenario for catastrophic failure in interconnect structures under chip package interaction

2015 IRPS | International Reliability Physics Symposium
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Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures

2015 IITC | International Interconnect Technology Conference
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B13-P-02 * New High Resolution FE-SEM Capable of High Speed Analysis and Electron-Energy-Selective Imaging

2015 Journal of Electron Microscopy
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J2210405 Torsion test of single crystal copper to observe dislocation motion under stress distribution

2015
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J2240407 Evaluation of mechanical energy required to separate Cu/SiN interface on different crystal orientations

2014
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Specimen size effect on elastic-plastic strength evaluation of interface between thin films

2014 Engineering Fracture Mechanics
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J2240406 Grain size effect on the distribution of local adhesion strength in copper interconnects structure

2014
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Recent progress in scanning electron microscopy for the characterization of fine structural details of nano materials

2014 Progress in Solid State Chemistry
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Fracture strength analysis of single-crystalline silicon cantilevers processed by focused ion beam

2014 Sensors and Actuators A-physical
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