Old Web
English
Sign In
Acemap
>
authorDetail
>
Vladimir Polezhaev
Vladimir Polezhaev
Materials science
Power electronics
Composite material
Engineering physics
Printed circuit board
5
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Top side isolation investigation of PCB embedded 1.2kV dies
2021
EMPC | European Microelectronics and Packaging Conference
Luca Link
Ankit Bhushan Sharma
Vladimir Polezhaev
Till Huesgen
Michael Vaas
Guenther Stohrer
Frank Koch
Show All
Source
Cite
Save
Citations (0)
Development of a novel 600V/50A power package with semiconductor chips sandwiched between PCB substrates using double-side Ag-sintering
2019
Vladimir Polezhaev
Ankit Bhushan Sharma
Alexander Schiffmacher
Lorenz Litzenberger
Juergen Wilde
Till Huesgen
Show All
Source
Cite
Save
Citations (0)
1