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Xuefen Ong

Nanyang Technological University

5

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Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package

2011 IEEE Transactions on Components, Packaging and Manufacturing Technology
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Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package

2010 Microelectronics Reliability
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Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

2009 Microelectronics Reliability
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Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package

2008 EPTC | Electronics Packaging Technology Conference
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A Systematic Underfill Selection Methodology for Fine Pitch Cu/Low-k FCBGA Package

2007 EPTC | Electronics Packaging Technology Conference
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