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Jui-Hsiung Huang
Jui-Hsiung Huang
National Taipei University of Technology
Materials science
Analytical chemistry
Through-silicon via
Copper
Wafer
2
Papers
59
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Copper electrodeposition in a through-silicon via evaluated by rotating disc electrode techniques
2010
Journal of Micromechanics and Microengineering
Tzu-Hsuan Tsai
Jui-Hsiung Huang
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Citations (12)
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