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Tatsuo Nagamatsu
Tatsuo Nagamatsu
Materials science
Flip chip
Electronic engineering
Electrical engineering
Soldering
4
Papers
15
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Improvement of C2W Collective Bonding Reliability and UPH through Innovations in Machine, Materials and Methods
2017
ECTC | Electronic Components and Technology Conference
Tomonori Nakamura
Farhan Shafiq
Tetsuya Otani
Osamu Watanabe
Toru Maeda
Yoshihito Hagiwara
Keiji Honjo
Tamotsu Owada
Daichi Mori
Outa Egashira
Tatsuo Nagamatsu
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Use of Non-conductive Film (NCF) with Nano-Sized Filler Particles for Solder Interconnect: Research and Development on NCF Material and Process Characterization
2016
ECTC | Electronic Components and Technology Conference
Tatsuo Nagamatsu
Keiji Honjo
Katsuyuki Ebisawa
Tomoyuki Ishimatsu
Takayuki Saito
Daichi Mori
Daisuke Motomura
Hidekazu Yagi
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Citations (5)
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