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Hyosung Nam

Hanyang University

5

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High-performance RF Power Amplifier Module using Optimum Chip-level Packaging Structure

2021 IEEE Transactions on Industrial Electronics
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A 6–18-GHz GaN Reactively Matched Distributed Power Amplifier Using Simplified Bias Network and Reduced Thermal Coupling

2018 IEEE Transactions on Microwave Theory and Techniques
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A 6–18 GHz GaN distributed power amplifier using reactive matching technique and simplified bias network

2017 RFIC | Radio Frequency Integrated Circuits Symposium
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