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Chenting Lin
Chenting Lin
Siemens
Copper interconnect
Electronic engineering
Dram
Interconnection
Materials science
4
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11
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Aluminum dual damascene metallization for 0.175 mm DRAM generations and beyond (invited).
1999
Microelectronic Engineering
R.F. Schnabel
L. Clevenger
Gregory Costrini
David M. Dobuzinsky
Ronald G. Filippi
Jeffrey P. Gambino
G.Y. Lee
Roy C. Iggulden
Chenting Lin
Z.G. Lu
X.J. Ning
R. Ramachandran
Maria Ronay
D. Tobben
S. J. Weber
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Citations (5)
Planarization of dual-damascene post-metal-CMP structures
1999
IITC | International Interconnect Technology Conference
Chenting Lin
Lawrence A. Clevenger
Florian Schnabel
Fen-Fen Jamin
D. Dobuzinski
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Slotted vias for dual damascene interconnects in 1 Gb DRAMs
1999
VLSIT | Symposium on VLSI Technology
R.F. Schnabel
Gary B. Bronner
Lawrence A. Clevenger
David M. Dobuzinsky
Gregory Costrini
Ronald G. Filippi
Jeffrey P. Gambino
M. Hug
Roy C. Iggulden
Chenting Lin
K. P. Müller
Gerhard Mueller
Joachim Nuetzel
Carl J. Radens
Stefan J. Weber
Franz X. Zach
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Citations (2)
1