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E. J. Lin

National Central University

12

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20

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Effect of De-Twinning on Tensile Strength of Nano-Twinned Cu Films.

2021 Nanomaterials
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Effect of eutectic reaction between depositing atoms and substrate elements on morphological evolution of Sn–Bi–Sn multilayer deposition

2020 Materials Chemistry and Physics
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Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys

2019 Journal of Alloys and Compounds
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Effect of interfacial dissolution on electromigration failures at metals interface

2017 Journal of Materials Science: Materials in Electronics
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Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates

2016 Journal of Electronic Materials
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