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Benedict T. Donnellan
Benedict T. Donnellan
University of Warwick
Electronic engineering
Materials science
Wafer
Wafer bonding
Optoelectronics
6
Papers
30
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Bipolar conduction across a wafer bonded p-n Si/SiC heterojunction
2013
Materials Science Forum
P. M. Gammon
Amador Pérez-Tomás
Michael R. Jennings
Ana M. Sanchez
Craig A. Fisher
Stephen M. Thomas
Benedict T. Donnellan
P. A. Mawby
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Citations (4)
Innovative 3C-SiC on SiC via direct wafer bonding
2013
Materials Science Forum
Michael R. Jennings
Amador Pérez-Tomás
Andrea Severino
Peter J. Ward
Arif Bashir
Craig A. Fisher
Stephen M. Thomas
P. M. Gammon
Benedict T. Donnellan
Hua Rong
Dean P. Hamilton
P. A. Mawby
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Citations (2)
Modelling of current sharing in paralleled current limiting superjunction MOSFETs with common gate drives
2012
Microelectronics Reliability
Benedict T. Donnellan
G. J. Roberts
P. A. Mawby
Angus T. Bryant
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Citations (3)
Introducing a 1200V vertical merged IGBT and Power MOSFET: The HUBFET
2012
APEC | Applied Power Electronics Conference
Benedict T. Donnellan
P. A. Mawby
M. Rahimo
L. Storasta
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Citations (6)
An investigation into the utilisation of power MOSFETs at cryogenic temperatures to achieve ultra-low power losses
2010
ECCE | Energy Conversion Congress and Exposition
K. Leong
Benedict T. Donnellan
Angus T. Bryant
P. A. Mawby
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Citations (10)
1