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Jaesik Lee
Jaesik Lee
Qualcomm
Electronic engineering
Interposer
Through-silicon via
Ball grid array
Wafer
3
Papers
25
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Micro Bump System for 2nd Generation Silicon Interposer with GPU and High Bandwidth Memory (HBM) Concurrent Integration
2018
ECTC | Electronic Components and Technology Conference
Jaesik Lee
Chun Yang Lee
Chongho Kim
Shantanu Kalchuri
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Citations (14)
First demonstration of drop-test reliability of ultra-thin glass BGA packages directly assembled on boards for smartphone applications
2015
ECTC | Electronic Components and Technology Conference
Bhupender Singh
Vanessa Smet
Jaesik Lee
Gary Menezes
Makoto Kobayashi
P.M. Raj
Venky Sundaram
Brian Roggeman
Urmi Ray
Riko Radojcic
Rao Tummala
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Citations (10)
Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
2015
Won Kyoung Choi
Duk Ju Na
Kyaw Oo Aung
Andy Yong
Jaesik Lee
Urmi Ray
Riko Radojcic
Bernard Adams
Seung Wook Yoon
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Citations (1)
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