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C. Ferrandon

4

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A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications

2013 DIC | IEEE International D Systems Integration Conference
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Innovative wafer-level encapsulation & underfill material for silicon interposer application

2013 ECTC | Electronic Components and Technology Conference
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Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration

2013 DIC | IEEE International D Systems Integration Conference
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