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Sangho An

Samsung

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A Study of 3D Packaging Interconnection Performance Affected by Thermal Diffusivity and Pressure Transmission

2019 ECTC | Electronic Components and Technology Conference
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Morphology of Corrosion of an Al Thin Film Covered by Polymer Epoxy Under a Humidity Condition

2018 Journal of Electronic Materials
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New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate

2015 Journal of Electronic Materials
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