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D J Walkey
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Thermal analysis
Resistor
Amplifier
Solid modeling
Predictive modelling
Electronic component
Physical model
Computer simulation
Temperature
HVAC
Integrated circuit
Boundary value problem
Equivalent circuit
Thermal resistance
Gallium arsenide
Geometry
Printed circuit board
Electronic packaging
Thermal conductivity
International System of Units
Bipolar junction transistor
Generally Accepted Auditing Standards
Heat transfer
Three-dimensional space
Capacitance
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Thermal analysis
Resistor
Amplifier
Solid modeling
Predictive modelling
Electronic component
Physical model
Computer simulation
Temperature
HVAC
Integrated circuit
Boundary value problem
Equivalent circuit
Thermal resistance
Gallium arsenide
Geometry
Printed circuit board
Electronic packaging
Thermal conductivity
International System of Units
Bipolar junction transistor
Generally Accepted Auditing Standards
Heat transfer
Three-dimensional space
Capacitance
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D J Walkey
Carleton University
43
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