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Avram Barcohen
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Forced convection
Chip
Thermal analysis
Thermal management of electronic devices and systems
Hot spot
Reliability
Temperature
Finite element method
Thermoelectric effect
Boiling
Integrated circuit
Heat transfer
Integrated circuit packaging
Thermal conductivity
Thermal resistance
Critical heat flux
Silicon
Thermal expansion
Heat sink
Polymer
Heat transfer coefficient
Heat flux
Packaging and labeling
Two-phase flow
Natural convection
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Forced convection
Chip
Thermal analysis
Thermal management of electronic devices and systems
Hot spot
Reliability
Temperature
Finite element method
Thermoelectric effect
Boiling
Integrated circuit
Heat transfer
Integrated circuit packaging
Thermal conductivity
Thermal resistance
Critical heat flux
Silicon
Thermal expansion
Heat sink
Polymer
Heat transfer coefficient
Heat flux
Packaging and labeling
Two-phase flow
Natural convection
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Avram Barcohen
University Of Maryland College Park
332
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