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Kaveh Azar
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Dissipation
Data analysis
Forced convection
Copper
Air cooling
Packaging and labeling
Integrated circuit packaging
Fluid dynamics
Electronic circuit
Glass
Printed circuit board
Computational fluid dynamics
Chip
Heat transfer coefficient
Thermal resistance
Aluminium
Natural convection
Thermal conductivity
Electronic component
Heat sink
Flow visualization
Temperature
Thermal management of electronic devices and systems
Convection
Heat transfer
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Dissipation
Data analysis
Forced convection
Copper
Air cooling
Packaging and labeling
Integrated circuit packaging
Fluid dynamics
Electronic circuit
Glass
Printed circuit board
Computational fluid dynamics
Chip
Heat transfer coefficient
Thermal resistance
Aluminium
Natural convection
Thermal conductivity
Electronic component
Heat sink
Flow visualization
Temperature
Thermal management of electronic devices and systems
Convection
Heat transfer
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Kaveh Azar
University Of Connecticut
32
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