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Paul S Ho
HIndex: 30
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Delamination
Packaging and labeling
Software Testing
X-ray crystallography
Transmission electron microscopy
Copper
Thermal expansion
Silicon
Failure analysis
Kinetics
Dielectric
Mass transfer
Chip
Grain boundary
Reliability
Finite element method
Thin film
Microstructure
Stress relaxation
Current density
Flip chip
Electromigration
Temperature cycling
Activation energy
Stress
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Delamination
Packaging and labeling
Software Testing
X-ray crystallography
Transmission electron microscopy
Copper
Thermal expansion
Silicon
Failure analysis
Kinetics
Dielectric
Mass transfer
Chip
Grain boundary
Reliability
Finite element method
Thin film
Microstructure
Stress relaxation
Current density
Flip chip
Electromigration
Temperature cycling
Activation energy
Stress
Paper Recommendation
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Match this author profile with one of the following researchers:
Author Name
Affiliation
Papers
Paul S Ho
University Of California San Diego
587
Paul S Ho
University Of Michigan
1
Paul S Ho
Simon Fraser University
1
Paul S Ho
Martin Marietta Materials Inc
1
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