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Timothy P Weihs
HIndex: 23
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Materials Science
Soldering
Transmission electron microscopy
Yield
Room temperature
Grain boundary
Thermal diffusivity
Computer simulation
Residual stress
Composite material
Shear strength
Ultimate tensile strength
Cantilever
Intermetallic
Thin film
Microstructure
Layers
Copper
Molecular dynamics
Crystal structure
Silicon
Grain size
Heat transfer
Nickel
Stress
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Materials Science
Soldering
Transmission electron microscopy
Yield
Room temperature
Grain boundary
Thermal diffusivity
Computer simulation
Residual stress
Composite material
Shear strength
Ultimate tensile strength
Cantilever
Intermetallic
Thin film
Microstructure
Layers
Copper
Molecular dynamics
Crystal structure
Silicon
Grain size
Heat transfer
Nickel
Stress
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Timothy P Weihs
Stanford University
127
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